ATS-11C-42-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11C-42-C1-R0-ND

Manufacturer Part#:

ATS-11C-42-C1-R0

Price: $ 6.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X22.86MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11C-42-C1-R0 datasheetATS-11C-42-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.82939
30 +: $ 5.50578
50 +: $ 5.18188
100 +: $ 4.85806
250 +: $ 4.53419
500 +: $ 4.21032
1000 +: $ 4.12935
Stock 1000Can Ship Immediately
$ 6.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are essential components designed to improve the efficiency of electric and electronic components and systems. They come in a variety of shapes, sizes, and materials and are used to dissipate excess heat generated during the electrical processes. An example of such a component is the ATS-11C-42-C1-R0 Thermal - Heat Sink.

The ATS-11C-42-C1-R0 Thermal - Heat Sink is designed to dissipate large amounts of heat from components or systems of electronic devices. The thermally-conductive material it is made from has an emissivity of 0.96, which ensures that the heat is efficiently dispersed in whatever environment it is placed. Furthermore, its forced air ventilation system increases the effective heatsink area and ensures that the temperature inside the device or system is maintained at optimal levels for optimal efficiency and performance.

The ATS-11C-42-C1-R0 Thermal - Heat Sink has a variety of applications. It is most commonly used to reduce the temperature in LED lighting systems, computers, servers, and other types of electronic systems. It is also used in the automotive industry, as it ensures that the temperature of the engine and other temperature-sensitive components remain within appropriate levels. Additionally, it is also used in other forms of thermal management solutions like heating, cooling, ventilation, etc.

The working principle of the ATS-11C-42-C1-R0 Thermal - Heat Sink is relatively simple. It consists of a thermally-conductive element that is designed to absorb the excess heat from the components or system. This component then dissipates the heat by conduction, convection, or radiation depending upon the cooling system being used. The thermal-conductive material ensures that the heat is efficiently dispersed in the environment. Additionally, the forced air ventilation system helps in dispersing the heat more effectively. This ensures that the components or systems of the electronic device remain at optimal temperature levels for optimal efficiency and performance.

In conclusion, the ATS-11C-42-C1-R0 Thermal - Heat Sink is an efficient and effective way to manage the excess heat generated in electronic components or systems. Its thermally-conductive material ensures that the heat is efficiently dispersed in the environment, while the forced air ventilation system helps in dispersing the heat more effectively. It is a versatile component that has a variety of applications in the automotive, computing, and LED lighting industries and is used to maintain optimal temperature levels for optimal efficiency and performance.

The specific data is subject to PDF, and the above content is for reference

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