| Allicdata Part #: | ATS-11C-59-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-59-C1-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-59-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical for many types of electronic components, especially those that are used in harsh and extreme environments. Heat sinks are essential for cooling systems, and finding the right one can be a challenge. The ATS-11C-59-C1-R0 is a high-performance heat sink designed for use in a variety of applications, including those in telecommunications, power electronics, and industrial automation. This article provides an overview of the ATS-11C-59-C1-R0’s application field and working principle.
The ATS-11C-59-C1-R0 is made from high quality, lightweight aluminum fins and it has extremely high thermal performance. This heat sink can dissipate up to 120 watts with an ambient temperature range of -25 to 105°C. It is designed to be able to withstand harsh conditions, such as high levels of vibration, shock, and corrosive substances that other types of heat sinks may not be able to handle. The ATS-11C-59-C1-R0 is available in different sizes, shapes, and finishes, allowing it to be integrated into various enclosures and thermal solutions.
As previously mentioned, the ATS-11C-59-C1-R0 is designed for a variety of applications. It is ideal for use in power electronics, telecommunications, and industrial automation. The device can be used to cool a variety of components, including power semiconductors and communication boards. It is also capable of dissipating low amounts of heat from electronic chips and switching power supplies. Additionally, the ATS-11C-59-C1-R0 can dissipate heat from digital ICs, processors, and microprocessors.
The ATS-11C-59-C1-R0’s working principle is fairly straightforward. The heat sink is designed to provide efficient thermal management by maximizing air flow. To do this, the device is equipped with cooling fins that are designed to draw in air from the environment. The fins also function to increase surface area, allowing more heat to be dissipated from the device. Additionally, the heat sink is designed to conduct heat away from the source by utilizing the aluminum base and fan.
Additionally, the ATS-11C-59-C1-R0 is designed to dissipate heat quickly and efficiently. It features a large heat transfer area, allowing for a greater level of thermal performance. The device also utilizes a radial fin design, which allows for superior air circulation and maximum cooling. Finally, the device is designed to minimize EMI (electromagnetic interference) by featuring low thermal resistance. This ensures that the device will not interfere with other electronic components.
In conclusion, the ATS-11C-59-C1-R0 is a high-performance, versatile heat sink designed for use in a variety of applications. It is made of lightweight aluminum and has an impressive thermal performance. Additionally, the device is designed to maximize air flow and dissipate heat quickly and efficiently. With its wide range of features, the ATS-11C-59-C1-R0 is an ideal choice for cooling systems in telecommunications, power electronics, and industrial automation.
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