| Allicdata Part #: | ATS-11C-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
Heat sinks are components designed to absorb and dissipate thermal energy in heat-producing components such as processors and integrated circuits. The ATS-11C-63-C1-R0 is a type of heatsink that has been designed specifically for application in a wide range of electronics. It is a thermally controlled component which allows for efficient heat transfer, and is designed to reduce the temperatures of electrical components, extending their life and improving their performance.
Construction
The ATS-11C-63-C1-R0 is constructed from an aluminum heat sink material which has been optimized for maximum heat transfer and features a metal mesh design. This allows the unit to be mounted in a variety of different configurations, making it ideal for use in a wide variety of applications. Additionally, it is designed to be compatible with various types of mounting solutions, such as quick-release clamps and non-slip nuts and bolts.
Application Field
The ATS-11C-63-C1-R0 is designed for use in a variety of electronic components and devices. It is ideally suited for use in processors, High Definition (HD) video cards, power supplies, personal computers, and servers. Additionally, the heatsink is suitable for use in laptops, PDAs, tablets, gaming consoles, and mobile phones.
Working Principle
The ATS-11C-63-C1-R0 works by absorbing the thermal energy produced by the electrical components and dissipating it through the aluminum heat sink body. This reduces the temperature of the components, thereby improving their performance and reliability. The active cooling system of the heatsink ensures that it maintains a constant low temperature, ensuring that all electrical components are operating optimally.
Conclusion
The ATS-11C-63-C1-R0 is a thermal - heat sink that is designed for use in a wide range of electronic components and devices. It is constructed from an aluminum material which has been optimized for maximum heat transfer, and features a metal mesh design. Additionally, it is designed to be compatible with various types of mounting solutions, such as quick-release clamps and non-slip nuts and bolts. The ATS-11C-63-C1-R0 works by absorbing the thermal energy produced by the electrical components and dissipating it through the aluminum heat sink body, thus reducing the temperatures of the components and improving their performance and reliability.
The specific data is subject to PDF, and the above content is for reference