| Allicdata Part #: | ATS-11C-66-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-66-C1-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-66-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-11C-66-C1-R0 has gained immense popularity in the thermal heat sink market for its impressive features and performance. This device is designed to efficiently and effectively dissipate heat from electronic components, thus reducing the amount of energy consumed. In this article, we will discuss the application field and working principle of the ATS-11C-66-C1-R0.
Application Field
The ATS-11C-66-C1-R0 is designed for use in various electronic products, and it can be found in a range of applications. From motherboards to hard drives, the ATS-11C-66-C1-R0 is used to support the operation of many devices. It is also utilized in industrial and commercial equipment, gaming consoles, laptops, tablets, and other electronic products. This heat sink is able to withstand high temperatures, making it suitable for use in high-power applications.
Working Principle
The ATS-11C-66-C1-R0 functions by dissipating heat away from the components of the device in which it is installed. It does this by integrating a number of small fins into a compact light weight structure. The fins act as a large surface area increasing the device’s heat dissipation rate. The fins are connected to a heat-conducting material, which absorbs the heat from the components and transfers it to the air. This is then expelled from the device\'s open heat exhausts. The use of this heat sink decreases the amount of energy consumption required for cooling the device.
Conclusion
The ATS-11C-66-C1-R0 is designed to maintain the performance and stability of electronic devices by dissipating heat away from its components. It can be used in various applications, from motherboards to industrial equipment. It is able to withstanding high temperatures, making it suitable for use in high-power applications. Thanks to its impressive features and performance, the ATS-11C-66-C1-R0 has become one of the most popular and widely used thermal heat sinks in the market.
The specific data is subject to PDF, and the above content is for reference