ATS-11C-68-C1-R0

Thermal - Heat Sinks

Heat sinks are devices used to dissipate heat away from critical components such as processors, memory chips, and power transistors. This is necessary to ensure components operate within optimal temperature ranges and don’t become damaged or fail to function properly due to overheating. Though heat sinks can take the form of simple aluminum fins on a processor, more complex heat sinks are available that offer improved performance and more effective heat dissipation.

The ATS-11C-68-C1-R0 is a specialized high performance heat sink designed for use in high temperature applications such as industrial electronics, robotics, power supplies, and avionics. The sink is constructed from copper and aluminum, and is designed to dissipate heat while also providing structural support. It features a flat section on the top of the device that can be used to mount the component to be cooled.

The ATS-11C-68-C1-R0 is capable of dissipating heat up to 210 W at 25 °C and can be used in temperatures up to 150 °C. It also features a thermally conductive silicone rubber pad that can absorb and dissipate additional heat. The device can also be customized to fit complex mounting angles or configurations when needed.

Working Principle

The ATS-11C-68-C1-R0 works by absorbing heat from the component being cooled and dissipating it away from the component. This is accomplished using the heat sink’s aluminum fins, which are designed to maximize surface area for better heat dissipation. When the heat sink is mounted onto the component, the fins absorb thermal energy from the component and spread it over the larger surface area of the fins. As a result, the component’s temperature is lowered.

The ATS-11C-68-C1-R0 also utilizes the thermally conductive silicone rubber pad to absorb heat from the component. This pad helps absorb more heat from the component, and then dissipates it away from the component. This helps to lower the temperature of the component, and ensure it operates within its optimal temperature range.

Application Fields

The ATS-11C-68-C1-R0 is a versatile and reliable heat sink that is well-suited for a variety of applications. Its unique construction and design makes it an excellent choice for both industrial electronics and robotics. Its thermally conductive silicone rubber pad makes it suitable for applications that require extreme temperatures, such as power supplies or avionics.

The ATS-11C-68-C1-R0 can also be used in a variety of other applications where effective heat dissipation is required, such as automotive electronics, medical devices, and telecommunications.

Conclusion

The ATS-11C-68-C1-R0 is an advanced, high performance heat sink that is designed for high temperature applications. Its construction of copper and aluminum makes it capable of efficiently dissipating heat away from components, and its thermally conductive silicone rubber pad helps absorb and dissipate additional heat. The ATS-11C-68-C1-R0 is well-suited for a variety of applications, including industrial electronics, robotics, power supplies, avionics, and more.