| Allicdata Part #: | ATS-11C-70-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-70-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-70-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical in many industries. An effective thermal management system will ensure the efficient operation of a system, as well as the overall safety of the system. The ATS-11C-70-C1-R0 is a thermal management solution designed specifically for advanced heat dissipation and air flow management in harsh environments.
The ATS-11C-70-C1-R0 is an in-line air-flow management solution that is designed to effectively dissipate and control heat from high-grade electrical and electronic components. It is equipped with an advanced air-flow design which maximizes air flow and enhances efficiency. The ATS-11C-70-C1-R0 also features enhanced temperature and flow measurement capabilities. This makes it ideal for use in applications requiring precise temperature and air flow control.
The ATS-11C-70-C1-R0 is a heat sink designed to dissipate heat generated by electrical and electronic components. It is constructed from high-grade aluminum and features a special coating to protect it from corrosion and other environmental elements. The design of the ATS-11C-70-C1-R0 ensures an efficient and effective transfer of heat from the component to the surrounding air. Additionally, the design ensures that the air is released at an efficient rate, allowing for maximum cooling performance.
The working principle of the ATS-11C-70-C1-R0 is relatively straightforward. The device is composed of a base plate and a number of aluminum fins. Inside the base plate are two tubes – an inlet tube and an outlet tube – connected to each other. The inlet and outlet tubes create an interlocking flow pattern which is optimized to provide an efficient and effective transfer of heat from the component to the surrounding air. When the device is in use, air is drawn into the inlet tube, and as the air passes through the interlocking flow pattern, heat is released into the surrounding air.
Due to its efficient design and reliable performance, the ATS-11C-70-C1-R0 is suitable for a variety of industrial and commercial applications. It is an ideal solution for cooling high-grade electrical and electronic components. Additionally, the device is perfect for controlling temperature in extreme environments, such as in high-voltage communications equipment. This heat sink is also suitable for use in industrial machine control, data centers, and many other applications.
The ATS-11C-70-C1-R0 is designed with a wide range of safety features, such as a built-in temperature cut-off switch and a high-quality automatic thermal protection system. The device is also highly reliable and has been subjected to rigorous tests to ensure its performance and durability. Furthermore, the ATS-11C-70-C1-R0 is RoHS compliant, meaning it is safe to use in both indoor and outdoor applications.
The ATS-11C-70-C1-R0 is a reliable and efficient heat sink designed specifically for advanced heat dissipation and air flow management. It is perfect for controlling temperature in extreme environments, and can be used for cooling high-grade electrical and electronic components. The device features an advanced air-flow design which maximizes air flow and enhances efficiency. The ATS-11C-70-C1-R0 is also built with a number of safety features to ensure reliability and durability.
The specific data is subject to PDF, and the above content is for reference