ATS-11C-70-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.70°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
The ATS-11C-70-C2-R0 is an advanced thermal heat sink designed and manufactured by Advanced Thermal Solutions, Inc. It is made from aluminum and features an innovative extruder blade design which provides maximum heat transfer performance. The ATS-11C-70-C2-R0 is ideal for applications such as consumer electronics, medical devices, power supplies, and automotive components where thermal management is required.Application Fields
The ATS-11C-70-C2-R0 is designed for use in a wide variety of applications that require thermal management. It can be used in consumer electronics to cool components such as processors, memory, and other circuits. It can be used in medical devices to cool imaging and diagnostic equipment. It can also be used in power supplies to reduce the temperature of components which may otherwise overheat. The ATS-11C-70-C2-R0 is also suitable for automotive components such as fuel injectors, turbochargers, and engines. All of these applications require efficient thermal management.Working Principle
The ATS-11C-70-C2-R0 uses an extruder blade design to create cooling channels and maximize heat transfer. This design works by forcing cool air through the channels and transferring it to the hot component being cooled. The air is drawn in from outside the device and is forced out by the bladed design. As the air is forced through the blades, it absorbs the heat from the component and then is expelled out of the device. This efficient heat transfer helps to reduce temperatures and maintain the desired operating temperatures for the device or component being cooled.Advantages
The ATS-11C-70-C2-R0 thermal heat sink offers several advantages over traditional thermal solutions. It is lightweight and can be installed quickly with minimal effort. It also has an excellent thermal conductivity rating and can dissipate heat more effectively than other methods. It is also highly resistant to shocks and vibration which makes it suitable for use in a wide range of industrial and automotive applications.Conclusion
The ATS-11C-70-C2-R0 thermal heat sink is an excellent solution for use in a wide variety of thermal management applications. It is designed to provide excellent heat transfer performance and to operate reliably in a wide range of temperatures and conditions. Its low profile design makes it an ideal solution for applications where space may be limited. For these reasons, the ATS-11C-70-C2-R0 thermal heat sink is an excellent choice for engineers and designers who require reliable thermal management solutions.

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