| Allicdata Part #: | ATS-11C-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are electronic components typically used to generate a cooling effect in order to manage system temperatures within acceptable ranges. Their application is greatest in enclosed environments such as computers where passive cooling strategies are not effective or practical. The ATS-11C-72-C1-R0 is a passive heat sink designed to provide thermal management for wide temperature range applications.
This heat sink is made of a combination of metal alloy materials which is machined and stamped into shape. It is designed to meet the performance requirements of the most demanding applications and is guaranteed to provide optimal thermal dissipation and lower system temperatures. The ATS-11C-72-C1-R0 is a highly efficient, lightweight passive heat sink that can be used in a variety of applications.
The ATS-11C-72-C1-R0 is designed to dissipate heat from hot components of a computer or other electronic device. It works by transferring heat away from these hot components and dispersing it into the surrounding air. The ATS-11C-72-C1-R0 is constructed from a high density aluminum alloy that is machined and stamped into shape to ensure maximum heat absorption and dissipation. The size and weight of the unit are optimized for the maximum cooling performance, and the heat sinks work by conduction.
The inside of the ATS-11C-72-C1-R0 consists of a series of fins that run parallel to each other. These fins are organized in a pattern to disperse and absorb as much heat as possible. This is done by drawing in cool air and circulating it around the fins to carry the heat away from the components of the computer. The fins also act as a heat reservoir, making sure that the components do not get too hot.
In addition to the fins, the ATS-11C-72-C1-R0 also has a base plate which is made from an anodized aluminum alloy and is designed to provide additional cooling benefits. This base plate provides additional insulation and helps further disperse the heat. On the bottom of the heat sink is a baseplate that is thermally conductive and designed to be mounted directly onto components. This baseplate helps to ensure that the heat from the components is removed quickly and efficiently.
The ATS-11C-72-C1-R0 is a highly efficient heat sink that offers superior cooling performance in a wide range of applications. It is designed to reduce system temperatures, increase component reliability, and reduce system noise. This robust thermal solution is ideal for high-performance applications such as gaming computers, servers, and industrial applications, as well as any other applications where thermal management is required.
The specific data is subject to PDF, and the above content is for reference