| Allicdata Part #: | ATS-11C-80-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-80-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-80-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
A thermal heat sink is a device used to conduct, transfer, and dissipate heat from a hotter component, known as the \'source\', to a different component, such as the \'target\'. In the case of ATS-11C-80-C1-R0, it is used to efficiently move the heat created by the processor within a computer system—away from the processor and to the rest of the system, to ensure the processor operates within temperature limits.
Thermal heat sinks can be made from various materials including metal, plastic, ceramic, wood, graphite and silicone. The most common heat sinks used today are made of aluminum and copper, as these materials have excellent thermal conductivity properties while also being relatively inexpensive. The primary function of a heat sink is to dissipate heat away from a heat-generating source by providing larger and better heat-conducting surfaces.
The shape of a thermal heat sink can vary in size and shape. Heat sinks can be flat or vertical, and may also have fins and protrusions to help maximize the surface area exposed to the environment, increasing the rate of heat transfer. Furthermore, some heat sinks are designed to include a fan to generate airflow across the fins, further increasing the rate of heat transfer. ATS-11C-80-C1-R0 is an all-aluminum thermal heat sink, incorporating a high-efficiency cooling fan and a fin design which increases the surface area exposed to ambient air.
ATS-11C-80-C1-R0 is a thermal heat sink that is designed for use with Intel processors with an 1151 or 2066 socket. It is designed to support Intel processors with a TDP (thermal design power) rating of 95W or less. The heat sink is capable of dissipating up to 95W of heat in an ambient temperature of up to 36°C (96.8°F).
The ATS-11C-80-C1-R0 thermal heat sink utilizes a patented fin design to produce a higher surface area which translates to improved heat transfer performance. The heat sink includes a 92mm fan which operates at a speed of 2000rpm, resulting in a high airflow of 56CFM, providing effective cooling performance. In addition, the fan is fitted with an optimized frame which reduces vibration and noise during operation.
Thermal heat sinks, such as the ATS-11C-80-C1-R0, are a key component in the efficient operation of computers and other devices. Thermal management solutions such as this allow processors and other components to operate within safe temperature limits, for optimal performance.
The specific data is subject to PDF, and the above content is for reference