| Allicdata Part #: | ATS-11D-04-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-04-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-04-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to transfer thermal energy by dissipating it into the surrounding environment. They are often used to increase heat dissipation from components within an electronic system or an electro-mechanical system. The ATS-11D-04-C1-R0 is a heat sink designed for use in a variety of applications requiring effective heat dissipation.
The device is made of a copper alloy top and base, with a cross-section area of 2.311 inches squared. The top of the sink is designed to have maximum strength against the thermal stresses that will be generated by the heat dissipated from the system. Inside the device, there is a thermally conductive tape which serves to form a “sealed box” between the top and base. Within this box, there is a heat sink element, consisting of 4x1 inch square fins, separated by a non-conductive gap of 1/4 inch. This forms a heat transfer surface that can effectively dissipate heat from the system.
The device is best used in applications requiring efficient heat dissipation, and in particular, it is an effective solution for applications that require a fairly large heatsink for efficient cooling. Examples include motors and other motor controllers, DC/DC converters, AC/DC converters, and microcontrollers. The device is also well suited for high-end applications such as industrial robotics, processors in server hardware, or high-powered telecommunications systems, where rapid cooling is essential.
In order to operate, thermal energy from the system must be conducted through the top of the heat sink. This is done through the interface between the thermally conductive tape and the top plate of the device. As thermal energy is conducted through the top, it is dissipated evenly throughout the device by the heat sink element. This process is aided by the presence of a heatsink fan, which draws in more air and further helps to dissipate heat from the system.
Heat dissipation is further enhanced by the louvers around the perimeter of the device. These louvers serve to improve thermal convection by drawing in cooler air from outside the unit and forcing it out through the louvers. This ensures that the devices remain cool even under heavy operating loads.
Overall, the ATS-11D-04-C1-R0 is a powerful and reliable heat sink designed for a variety of applications. Its high-performance design and robust construction ensures that it can provide effective cooling in even the toughest conditions. By providing efficient heat dissipation, the device can help systems to operate at the peak of their performance.
The specific data is subject to PDF, and the above content is for reference