ATS-11D-09-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.68°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
The ATS-11D-09-C3-R0 is a thermal device designed to dissipate heat from electrical components. It is a type of heat sink, which is an enlarged surface with small fins and pins, usually made from aluminum, which helps to move thermal energy (heat) away from the components by way of air travel through the fins. The ATS-11D-09-C3-R0 is small and lightweight, making it perfect for use in applications where space is limited.Application Field
The ATS-11D-09-C3-R0 is primarily used in automation systems, computer systems, and electronic equipment. It is designed for use in environments where extreme temperatures are present, such as in outdoor applications. It is also recommended for use in environments with high vibration levels, as its fins provide additional shock absorption.The ATS-11D-09-C3-R0 can be used in a variety of industries, including industrial and automotive applications. It has also been used in military applications for its high performance in extreme environments.Advantages
The ATS-11D-09-C3-R0 is an efficient and reliable heat sink. Its use will provide improved heat dispersion due to its large surface area and the fins and pins of the device. The device is also designed to be lightweight, making it ideal for use in applications where weight is a consideration.The ATS-11D-09-C3-R0 is designed with an easy to use mounting system which allows for quick installation. The assembly of the device is also relatively simple, and it requires no additional components for installation.Disadvantages
The ATS-11D-09-C3-R0 is a limited heat sink and may not be suitable for all applications. It may not provide the amount of heat dissipation required for heavy duty applications. Additionally, the device may become clogged with dust and dirt which can reduce its overall efficiency.Working Principle
The ATS-11D-09-C3-R0 is designed to work in a similar way to a radiator. Heat energy is drawn away from electrical components by the fins on the device and the air passing through them. The fins aid in air flow and speed up the process. The heat is then dissipated into the air.The fins of the device act as a barrier, trapping air inside and allowing the air to spread across the entire surface of the device. This helps to dissipate the heat faster and more evenly, allowing for more efficient heat dispersion.Conclusion
The ATS-11D-09-C3-R0 is a thermal device designed to dissipate heat from electrical components. It is a type of heat sink, which is an enlarged surface with small fins and pins, usually made from aluminum, which helps to move thermal energy (heat) away from the components by way of air travel through the fins.This device is suitable for use in automation systems, computer systems, and electronic equipment. It has been used in industrial and automotive applications, as well as in military applications. The ATS-11D-09-C3-R0 is an efficient and reliable heat sink which is lightweight and easy to mount.The device works by drawing heat away from electrical components via the fins on the device and air passing through them. The fins help to spread the air over the entire surface of the device, allowing for more efficient heat dispersion.

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