ATS-11D-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11D-10-C3-R0-ND

Manufacturer Part#:

ATS-11D-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11D-10-C3-R0 datasheetATS-11D-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal energy, or heat, is an essential form of energy in most physical systems. Heat sinks are devices that are used to dissipate or remove thermal energy from a system. The ATS-11D-10-C3-R0 heat sink is a type of thermal heat sink that is designed for low to medium power applications. The ATS-11D-10-C3-R0 heat sink has a wide variety of applications and is a popular choice for engineers and technicians alike.The ATS-11D-10-C3-R0 is designed to dissipate heat in a number of ways. First, it works by providing a low thermal resistance between the heat-generating components and the ambient air. This reduces the amount of heat that is generated due to the large surface area that the heat sink provides. When air passes over the ATS-11D-10-C3-R0, the heat-dissipating fins help to cool the air, resulting in the transfer of thermal energy away from the system’s components.Heat dissipated by the ATS-11D-10-C3-R0 is also managed through the use of a fan or blower. This is an essential component in keeping the power components cool, as the fan helps to circulate the air. The fan speed can be adjusted as needed, depending on the application and the temperature of the system. By increasing the fan speed, more heat can be removed from the system, resulting in components that remain cool longer.Additionally, the ATS-11D-10-C3-R0 provides protection against thermal shock, which can occur when components experience sudden changes in temperature. The heat sink provides a buffer that helps to protect components from rapid temperature changes. This ensures that components do not experience failures due to thermal shock.The ATS-11D-10-C3-R0 is compatible with cooling systems such as liquid-to-air or thermoelectric cooling solutions. It is an ideal cooling solution for applications that require maximum cooling efficiency and low to moderate heat dissipation.In addition to its heat-dissipation capabilities, the ATS-11D-10-C3-R0 also offers a number of additional benefits. The heat sink is designed with high durability in mind, and it is corrosion-resistant. This helps to ensure that the device will last longer and remain effective in a variety of environmental conditions. The device is also easy to install, with no tools required.Overall, the ATS-11D-10-C3-R0 is an effective thermal heat sink that is designed for low to medium power applications. Its wide range of applications and its durable design make it an ideal cooling solution for a variety of different systems. The heat sink is powerful enough to remove thermal energy and protect components from thermal shock, while also providing additional benefits such as corrosion-resistance and ease of installation.

The specific data is subject to PDF, and the above content is for reference

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