| Allicdata Part #: | ATS-11D-107-C3-R1-ND |
| Manufacturer Part#: |
ATS-11D-107-C3-R1 |
| Price: | $ 4.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-107-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.44150 |
| 30 +: | $ 4.19496 |
| 50 +: | $ 3.94808 |
| 100 +: | $ 3.70138 |
| 250 +: | $ 3.45462 |
| 500 +: | $ 3.20786 |
| 1000 +: | $ 3.14617 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11D-107-C3-R1 thermal - heat sinks are an essential component of many electronic applications. They are designed to dissipate heat and provide thermal stability to the application. The sinks come in a variety of sizes and are usually composed of aluminum or copper. The heat sinks must be paired with a fan or other cooling device in order to effectively dissipate heat.
A typical thermal - heat sink is composed of a thermal conduction material, typically aluminum or copper, and an array of fins. The metal body of the sink acts as a heat spreading plate. The fins are designed to maximize the surface area and provide passive cooling. As air passes over the fins, the heat is transferred away from the components and dissipated into the environment. The thermal - heat sink must be kept free from dust and other particles to maintain its efficiency.
The thermal - heat sink can be used in a variety of ways and for a variety of applications. It can be used as a heat sink in applications that require a temperature reduction, and it can be used in devices that require a secondary heat source. The thermal -heat sink can also be used as part of an active cooling system, such as with a fan or other cooling device.
The ATS-11D-107-C3-R1 has a maximum power dissipation of 37.2 watts and is capable of dissipating heat from devices with up to 85.2 watts of power. The sink is made from a black anodized aluminum alloy and has a weight of 500.3 grams. The fins are spaced 0.75 mm apart, and the total surface area is 33.5 cm squared. The sink is designed to fit into a common 50mm diameter hole. The thermal - heat sink is rated at a maximum operating temperatures of 85°C.
To ensure thermal stability, the thermal - heat sink must be paired with an appropriate fan or other cooling device. The fan must be able to move enough air over the fins to effectively dissipate heat. The fan must be selected based on the application’s power requirements and environmental conditions. The air resistance must also be taken into account to ensure optimal performance.
The ATS-11D-107-C3-R1 thermal - heat sink is designed for a variety of applications, including electronic devices, industrial equipment, and consumer electronics. It is an efficient cooling solution that can provide thermal stability and effective heat dissipation. The sink is manufactured with high quality materials to ensure reliability and durability for years to come.
The specific data is subject to PDF, and the above content is for reference