ATS-11D-114-C3-R0

The ATS-11D-114-C3-R0 is a type of heat sink that is used in many different applications for its ability to manage heat. Heat sinks are used to dissipate unwanted heat from electrical components such as CPUs, GPUs, and other devices. Heat sinks are usually machined from metal such as aluminum or copper, and can be found in a variety of shapes and sizes. The ATS-11D-114-C3-R0 is an incredibly versatile heat sink that is designed to fit into narrow or tight spaces. It is ideal for those looking to maximize space and ensure that the heat producing components stay cool.

The ATS-11D-114-C3-R0 is designed with a full-copper base, which provides excellent thermal conductivity. The base measures 0.27” in length, which fits perfectly into tight spaces. The fins of the heat sink are soldered to the base and feature a zigzag design that helps increase surface area and ensures optimal thermal performance. This heat sink also comes with a pre-applied thermal grease, which helps aid the thermal transfer between the heat sink and the component.

The ATS-11D-114-C3-R0 has a variety of applications, but is primarily used in devices where heat needs to be dissipated from small and compact spaces. This lightweight and versatile heat sink is typically used in gaming consoles, mini PCs, home automation, and 5G phones, as well as for many other applications. This heat sink can also be used in automotive applications, as it is able to dissipate heat quickly and efficiently.

The ATS-11D-114-C3-R0 features an outstanding thermal performance and is able to transfer heat quickly and efficiently. This heat sink offers up to 7.5 W/mK thermal conductivity, which makes it one of the most efficient heat sinks in its class. The copper base helps ensure that the heat is dissipated quickly from the components to the fins, which then transfer the heat into the surrounding environment. This allows the device to remain cool and operate safely and efficiently.

The ATS-11D-114-C3-R0 has an incredibly compact size which makes it ideal for use in small devices. This heat sink has a profile of only 0.037” and is incredibly light, weighing only 1.7 g. This makes it ideal for those looking to maximize their space and ensure all components remain cool. This heat sink can also be easily installed into a device, as it does not require any additional parts or tools.

Overall, the ATS-11D-114-C3-R0 is an excellent choice for those looking for a highly efficient heat sink that offers excellent thermal performance and can fit into small and tight spaces. This heat sink is versatile and can be used for a variety of applications from automotive to gaming consoles and more. With its pre-applied thermal grease, lightweight design, and full-copper base, the ATS-11D-114-C3-R0 is a great choice for those looking to keep their device running cool and efficiently.