| Allicdata Part #: | ATS-11D-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal devices used to dissipate the heat generated by a number of electronic components, such as CPUs, GPUs, and other power-loss components. ATS-11D-139-C1-R0 is a type of heat sink specially designed to help dissipate the heat produced by such components. This type of heat sink offers several advantages over its competitors, including: high efficiency, excellent durability, good cooling performance, and low cost.
The ATS-11D-139-C1-R0 heat sink is composed of a number of copper fins and a flattened base. The copper fins are arranged into small clusters, placing the fins in close proximity to one another. This allows the heat produced by the electronic components to be very quickly and completely conducted away from the components and dissipated into the environment. The flattened base provides a stationary base, allowing the fins to be arranged in a specific pattern and providing a large surface area for the heat to dissipate.
The ATS-11D-139-C1-R0 heat sink uses the principle of natural convection to assist in dissipating the heat away from the components and into the environment. Natural convection occurs when the warmer air rises and is replaced with cooler air below. As the warmer air rises, the cooler air below circulates and absorbs the heat from the fins. This convective process of heat removal is then repeated, allowing the heat sink to maintain a high cooling efficiency.
The ATS-11D-139-C1-R0 heat sink is suitable for use in many applications such as digital video processing, audio processing, and power electronics. It is also ideal for use in high-performance applications that require faster thermal transfer, such as gaming systems and other high-performance processors. The heat sink is also suitable for use in environments where space is limited due to its compact size, low weight, and excellent thermal efficiency.
The ATS-11D-139-C1-R0 heat sink is an effective and cost-effective solution for dissipating the heat generated by electronic components. Its simple, efficient design ensures optimal thermal transfer and improved performance in even the most demanding applications. Its small size and low weight make it ideal for use in small spaces, while its high-efficiency natural convection design ensures maximum thermal transfer and long-term durability.
The specific data is subject to PDF, and the above content is for reference