| Allicdata Part #: | ATS19131-ND |
| Manufacturer Part#: |
ATS-11D-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are a type of heat transfer device used in a variety of contexts. ATS-11D-142-C2-R0 is a heat sink designed specifically for cooling and cooling systems. In order to understand how this device works, it is important to understand the application field and working principle of the device in greater detail.
The general purpose of a heat sink is to dissipate heat away from the object or system that is generating the heat, and transfer that heat into the atmosphere or another cooling medium. This is done by providing an increased surface area onto which the heat can be dissipated. ATS-11D-142-C2-R0 is a type of heat sink designed to do just that. This heat sink device is made with a high-grade aluminum, and has a finned design to increase the total surface area available for heat dissipation.
The device is essentially composed of two components, a base and a cover. The base is in contact with the heat source, and acts as a medium to transfer the heat generated by the system away from the source to the external environment. The finned design of the base itself helps increase the surface area available for heat dissipation. The cover, which is attached to the base, acts as an additional heat transfer medium, allowing heat to escape from the base to the external environment.
The finned design of the ATS-11D-142-C2-R0 heat sink also helps to improve its cooling capability. The increase in the surface area available for heat dissipation allows the heat to more efficiently spread out across the fins, increasing the rate of cooling. In addition, the fins serve as an additional heat transfer medium, providing more surface area for the heat to escape from the heat source.
The ATS-11D-142-C2-R0 heat sink is designed to be used in applications where efficient cooling and dissipation of heat are required. The device is commonly used in applications such as automotive engines, HVAC systems, electronic equipment, and industrial cooling systems. It is ideal for these applications where efficient cooling is essential in order to prevent overheating and system breakdown.
The ATS-11D-142-C2-R0 heat sink is designed to provide heat dissipation and cooling of critical components in any system. Its finned design provides increased surface area for efficient heat transfer away from the heat source. Its durable construction and robust design make it ideal for applications requiring efficient cooling and heat dissipation, such as automotive engines, HVAC systems, and electronic equipment.
The specific data is subject to PDF, and the above content is for reference