| Allicdata Part #: | ATS-11D-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in the maintenance and operation of electronics and various electronic components themselves. Heat sinks, also known as heatsinks, are often employed in this application as a means to heat dissipation
The ATS-11D-145-C1-R0 is a type of heat sink that can be used in thermal management. It is a non-ventilated heat sink with a heatsink body size of 145 mm and a total height of 11 mm. The product features optimal conduction performance and low thermal resistance. Moreover, its robust construction makes it highly reliable and suitable for long-term and stable usage.
The main application field of ATS-11D-145-C1-R0 is the cooling of electronic devices, particularly those that are vulnerable to overheating or are running in hot environments. Its effective radiative and convective heat dissipation properties make it an ideal solution for maintaining efficient temperatures in sensitive areas and applications. This heat sink can also be used to cool down power transistors, high-power diode diodes, capacitors, and other heat-generating electronic devices.
In terms of its working principle, ATS-11D-145-C1-R0 relies on the basics of thermodynamics, specifically the process of convection - which refers to the movement of heat from a warmer object to a cooler one. The heat sink is designed in such a way that it facilitates fast and efficient heat transfer and radiative cooling. Its metal body is connected to the device in need of cooling with a material that has a low thermal resistance. This feature, in combination with its optimized shape, helps separate the heat flow between the two objects and prevents excessive rise in temperature.
In summary, the ATS-11D-145-C1-R0 is an efficient heat sink suitable for heat management applications and cooling down sensitive electronic devices. It relies on the process of convection for its working principle and features a solid and robust construction for reliable performance. This heat sink is particularly effective in hot environments and can be used to extend the life of electronic components.
The specific data is subject to PDF, and the above content is for reference