ATS-11D-153-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11D-153-C3-R0-ND

Manufacturer Part#:

ATS-11D-153-C3-R0

Price: $ 3.91
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11D-153-C3-R0 datasheetATS-11D-153-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.55131
30 +: $ 3.35370
50 +: $ 3.15643
100 +: $ 2.95917
250 +: $ 2.76189
500 +: $ 2.56462
1000 +: $ 2.51530
Stock 1000Can Ship Immediately
$ 3.91
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a type of heat sinks designed to dissipate heat efficiently in many applications. ATS-11D-153-C3-R0 heat sinks are one such type, which are designed for motor drives, programmable logic controllers, power supplies and communication systems. This heat sink is designed with a 3-inch flange size, a 1.5 inch body and an efficient cooling fan. It has a maximum air flow of 105 CFM, and a maximum temperature of 110°F. It is a low-profile heat sink that is capable of dissipating large amounts of heat, while still being lightweight and compact.

The application field of the ATS-11D-153-C3-R0 heat sinks is vast, as it is suitable for many electronic devices and components. It can be used in PLCs, VFDs, UPS systems, power supplies, motor drives, inverters, communication systems, and other types of microprocessors. This heat sink is also suitable for any type of electronic board that requires an efficient way of cooling down. In addition, it was designed to be compatible with most types of enclosures such as cabinets, boxes, and racks.

The working principle of the ATS-11D-153-C3-R0 heat sinks revolves around its cooling fan. The fan’s blades are designed to maximize air flow, which helps cool down the heat sink. The fan has an adjustable speed, which can be set to low, medium or high, depending on the desired cooling effect. The fan blades also help spread the heat evenly across the heat sink, which helps dissipate the heat more efficiently. Additionally, the heat sink itself increases surface area, which aids in the dissipation of heat.

The ATS-11D-153-C3-R0 heat sink is also made from heat-resistant materials, which are designed to effectively dissipate heat from the electronic components. The materials used are usually composed of advanced metals such as aluminum, copper, or other alloys, which are capable of dissipating heat through their combination of thermal and mechanical properties. Furthermore, this type of heat sink has an ingress protection rating of IP 65, which means that it is resistant to dust and water.

The ATS-11D-153-C3-R0 heat sink is an efficient and reliable type of heat sink, which is designed to dissipate heat effectively in many applications. Its large surface area helps increase its cooling efficiency, while its adjustable speed fan helps evenly spread the heat across the heat sink. Additionally, its use of heat-resistant materials helps to dissipate heat quickly and effectively, while its IP 65 rating gives the component an added level of protection from dust and water.

The specific data is subject to PDF, and the above content is for reference

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