| Allicdata Part #: | ATS-11D-155-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-155-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-155-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.34°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are often used to dissipate heat generated by electronic components. One popular heat sink is the ATS-11D-155-C1-R0, which is designed to provide efficient cooling capabilities at relatively low cost. This article will discuss the application field and working principle of the ATS-11D-155-C1-R0 heat sink.
Application Field:
The ATS-11D-155-C1-R0 heat sink is designed for use in a variety of applications, ranging from industrial and consumer electronics to automotive and telecommunication equipment. Specifically, it is suitable for cooling CPUs, GPUs, FPGAs, ASICs, DSPs, as well as other microelectronic components that generate heat during operation. Additionally, it is compatible with a wide range of voltage and current requirements.
Due to its size and compatibility with a variety of components, the ATS-11D-155-C1-R0 is an ideal solution for applications where space and cost are of primary concern. Additionally, it provides excellent thermal performance with minimal energy consumption, making it a popular choice for energy-efficient cooling solutions.
Working Principle:
The ATS-11D-155-C1-R0 heat sink works by dissipating heat from an electronic component through a combination of conduction, convection, and radiation. Conduction is the process of heat transfer through the material of the heat sink. This occurs when a hot component is placed in contact with the heat sink, causing the heat to transfer along the path of least resistance. Convection is the process of heat transfer through the air around the heat sink. This occurs when the hot air generated by the component is replaced by cooler air, resulting in a net transfer of heat away from the component. Finally, radiation is the process of heat transfer through the electromagnetic radiation emitted from the component. This occurs when the radiation is absorbed by the heat sink, causing it to heat up, thus resulting in a net transfer of heat from the component.
In addition to conduction, convection, and radiation processes, the ATS-11D-155-C1-R0 heat sink also utilizes a fan to facilitate enhanced thermal performance. The fan helps to circulate air around the heat sink, thus helping to reduce local variations in temperature. This allows for more efficient cooling over a larger area, resulting in better component cooling and better overall thermal performance.
The ATS-11D-155-C1-R0 heat sink is a popular and cost-efficient cooling solution for many electronic components. Its application field ranges from industrial and consumer electronics, to automotive and telecommunication equipment. Furthermore, its efficient thermal performance and low-cost make it a great option for energy-efficient cooling solutions. Additionally, its combination of conduction, convection, radiation, and fan-aided air circulation provide enhanced thermal performance while minimizing energy consumption.
The specific data is subject to PDF, and the above content is for reference