ATS-11D-160-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.67°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-11D-160-C2-R0 Thermal-Heat Sink

The ATS-11D-160-C2-R0 is a thermal-heat sink manufactured by the company Advanced Thermal Solutions, Inc (ATS). This device is designed to conduct and dissipate heat from electronic components to a given ambient air temperature faster and more efficiently than traditional heat sinks. It also helps to reduce component failures due to overheating.

Application Fields

The ATS-11D-160-C2-R0 is ideal for a variety of high-power electronics and industrial applications. This includes, but is not limited to, server and other data center cooling, telecommunications equipment, LED lighting, consumer product electronics, solar energy systems, and medical device electronics.This thermal-heat sink offers thermal management solutions that shape the design of powerful electronic equipment by offering advanced design capabilities and advanced packages that can reduce the space requirements of thermally-managed electronic systems.

Working Principle

The ATS-11D-160-C2-R0 is designed to conduct and dissipate heat away from electronic components faster and more efficiently than traditional heat sinks. This is achieved by using a combination of convection, thermal conduction, and radiative heat transfer processes to move heat to the external ambient air quickly and efficiently.The heat sink is composed of a base and a series of fins attached to the base. The base material is typically made of copper or aluminum to ensure high thermal conductivity. The fins are designed to increase the surface area of the thermal-heat sink, which helps to further increase the rate of heat dissipation.The fins are designed in such a way that air can flow in and out of the fins and contact the base, dissipating the heat from the thermal-heat sink to the ambient air around it. The more heat dissipated, the lower the overall temperature of the electronic components.

Conclusion

The ATS-11D-160-C2-R0 thermal-heat sink is a highly efficient way to dissipate heat from almost any high-power electronic components. It helps reduce the chance of component failure due to overheating. It can be used for a variety of electronic systems, including but not limited to servers and data centers, telecommunications equipment, LED lighting, consumer products, solar energy systems and medical device electronics.

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