| Allicdata Part #: | ATS-11D-162-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-162-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-162-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for any electronic device as heat is generated during its operation. The accumulation of this heat can lead to system instability, decreased component life, and even complete failure. Heat sinks are components that are used to remove this heat and are often used in conjunction with the device’s fans and air cooling systems. A variety of different types of heat sinks are available, with the ATS-11D-162-C1-R0 being one of the most popular.
The ATS-11D-162-C1-R0 is a thermal heat sink designed for direct attachment to the top of an integrated circuit (IC) package. The main body of the heat sink is made of aluminum and is fitted with a plastic vent plate that helps to dissipate the heat from the IC. Two pins are also provided which allow for easy connection to the device’s power source. The ATS-11D-162-C1-R0 has proven to be an effective method of heat dissipation thanks to its high efficiency and low cost.
The ATS-11D-162-C1-R0 works by directing the heat from the IC away from the device and into the surrounding air. Heat is transferred from the IC to the heat sink by conduction, before it is then removed by convection. This is achieved through the use of metal fins which are added to the heat sink and help to dissipate the heat as air is circulated around them. As the heat is dissipated from the heat sink, it is drawn in by the fan or air cooling system and exhausted outside the device, thus maintaining the device’s temperature.
The ATS-11D-162-C1-R0 is most commonly used in personal computers, servers, industrial computers, and a range of other electronic devices. It has also become a popular choice for automotive applications, as it is able to withstand extreme temperatures and harsh environmental conditions. This heat sink is also available in a variety of sizes and shapes, making it suitable for a wide range of applications.
In conclusion, the ATS-11D-162-C1-R0 is a highly effective thermal heat sink that is suitable for a wide range of uses. It is designed to conduct heat quickly and efficiently, and it can also withstand extreme temperatures and harsh environmental conditions. It is also extremely cost effective due to its low production costs, making it a popular choice for a variety of thermal management applications.
The specific data is subject to PDF, and the above content is for reference