| Allicdata Part #: | ATS-11D-167-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-167-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-167-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components of electronics and thermoelectric systems. They help dissipate heat created during the operation of electronic circuits and protect them from being damaged by overheating. The ATS-11D-167-C1-R0 is a type of heat sink that is used to cool components and systems in a variety of applications. In this article, we will discuss the application field and working principle of the ATS-11D-167-C1-R0.
Application Field
The ATS-11D-167-C1-R0 is used in a wide range of applications. These include electronic, telecoms, automotive, medical, solar, consumer and industrial. It is often used in devices that require thermal management for their components, such as mobile phones, laptops, tablets, televisions, and power supplies. It can also be used in drones, cameras, robotics, and other devices.
The ATS-11D-167-C1-R0 is designed for high-power boards and modules, which require efficient cooling and heat dissipation. It features a low-mass aluminum plate with high-conductivity copper heat spreaders. This combination enables good thermal transfer between the heat source and the heat sink.
Working Principle
The ATS-11D-167-C1-R0 works by transferring heat away from the component it is cooling. This is achieved through the use of metal fins that increase the surface area available for heat transfer. The fins are made from aluminum or copper and are connected to a metal plate made of the same material. Heat produced by the component is absorbed by the plate, and the fins dissipate the heat by transferring it to the surrounding air.
The ATS-11D-167-C1-R0 also features a high-performance grease between the metal fins and the metal plate. This grease improves the thermal contact between the two components, making the heat transfer more efficient. The heat sink also has a thermal resistance that is adjustable. This allows users to adapt the heat sink to different components and power requirements.
The ATS-11D-167-C1-R0 is designed to be mounted on top of the component. It has a mounting bracket that securely fixed it to the component and ensures good thermal contact between the two. The mounting is strong enough to withstand the thermal forces of the component it is cooling.
Conclusion
The ATS-11D-167-C1-R0 is a thermal - heat sink designed for a wide range of applications. It works by transferring heat away from the component it is cooling, using metal fins, a metal plate, and a high-performance grease. The heat sink also has adjustable thermal resistance and a secure mounting bracket. These features make the ATS-11D-167-C1-R0 an ideal choice for cooling high-power components and systems.
The specific data is subject to PDF, and the above content is for reference