ATS-11D-169-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11D-169-C1-R0-ND

Manufacturer Part#:

ATS-11D-169-C1-R0

Price: $ 3.27
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11D-169-C1-R0 datasheetATS-11D-169-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.97234
30 +: $ 2.89170
50 +: $ 2.73105
100 +: $ 2.57040
250 +: $ 2.40975
500 +: $ 2.32942
1000 +: $ 2.08845
Stock 1000Can Ship Immediately
$ 3.27
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.66°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-11D-169-C1-R0 heat sink is an integral part of a temperature control system used in a variety of industrial applications. Heat sinks are installed to reduce the temperature of components and keep them in optimal operating conditions. The ATS-11D-169-C1-R0 is a thermal device typically employed in equipment requiring extremely precise temperature control.

The ATS-11D-169-C1-R0 is a type of heat sink that utilizes a combination of thermal conduction and convection to manage the temperatures of a certain object or system. This device is engineered to transfer heat quickly and dissipate it with a steady flow, allowing for the precise control of the target temperature. It features a sturdy aluminum base that is designed to effectively conduct heat away from the object it is installed on. The aluminum base contains fins that effectively radiate generated heat outwards, maximizing cooling efficiency.

The ATS-11D-169-C1-R0 employs a deep surface system to disperse heat uniformly. This system utilizes a unique design to transfer heat evenly across the surface, ensuring uniform cooling. The fins on the device further act as a heatsink, allowing for an efficient exchange of air that reduce the core temperature. This device also has an integrated fan, which helps it maintain a low temperature by circulating ambient air around the fins.

The ATS-11D-169-C1-R0 heat sink is widely used in many industrial settings, including industrial plants, semiconductor manufacturing, medical equipment, and transportation. This device typically requires minimal maintenance, as it is designed to be durable and reliable. Due to its excellent temperature control properties, the ATS-11D-169-C1-R0 is highly sought after by companies requiring temperature regulation in their systems.

In short, the ATS-11D-169-C1-R0 heat sink is a highly effective temperature control device that employs a combination of thermal conduction and convection to manage the temperature of systems. It utilizes a deep surface system to disperse generated heat evenly, as well as fins that radiate heat outward to improve efficiency. The ATS-11D-169-C1-R0 is used widely in industries such as semiconductor manufacturing, medical equipment, and transportation. Its efficient temperature regulation makes it a valuable asset to a variety of organizations.

The specific data is subject to PDF, and the above content is for reference

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