ATS-11D-169-C2-R0

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Thermal Management is a critical topic in the electrical & electronic engineering space, including all devices involved in any kind of energy conversion. Heat is always generated from the conversion process. ATS-11D-169-C2-R0 is one of the heat sinks, which can be used to efficiently handle the heat generated by electrical and electronic components. Heat sinks are passive (no internal source of power) devices which active cooling methodologies to effectively dissipate heat from components to a surrounding medium.

ATS-11D-169-C2-R0 application field and working principle

The main application field of ATS-11D-169-C2-R0 is within electrical & electronic engineering and it is a low profile, Cost effective heat sink solution for TO-220 power. Mainly, it can be used in power amplifiers, power supplies, DC-DC Converters, Printers, Audio amplifiers and LED lighting.

The ATS-11D-169-C2-R0 actively removes waste heat by using natural or forced convection. In natural convection, the waste heat of the component is dissipated to the surrounding air via natural convective flow. Forced convection, on the other hand, is when a fan is used to force the warm air to flow away and draw in cooler air.

The main working principle of ATS-11D-169-C2-R0 heat sinks is to create a thermal link between the heat source and the finned heat sink. When the heat source is attached to the heat sink, heat is transferred from the heat source to the fins. The heat is then distributed over the fin surface area and transferred to the surrounding airflow. The air which is now warmer, rises and cool air is drawn in beneath the fins. This process of thermal transfer ensures efficient heat dissipation from the heat source efficiently.

The key design features of ATS-11D-169-C2-R0 includes its dimension of 20x12x2 mm and its weight of only 2 gram. As well, its operating temperature range is from -55°C to +155°C and the maximum junction temperature of the component is not to exceed 125°C. It is made using AL6063-T5 alloy material which provides it with excellent durability, strength, and oxidation resistance. It also features a patented one-piece two-clip design for easy installation. In addition, the built-in polarity marks are also very useful to avoid solder problems.

In order to ensure efficiency, one should always remember to create an air gap between the fin surface and the cooling fan. Heat sinks with more fins will facilitate faster heat dissipation but the total area should not exceed the recommended area of the component. The efficiency of the device can also be enhanced by increasing the size of the fan and/or adding additional fans. Last but not least, maintaining proper air circulation in the environment where the device is located is of utmost importance.

ATS-11D-169-C2-R0 is rarely used as a stand-alone heat sink. Instead, it is used complementary heat sink where larger and more effective heat sinks are used in combination with ATS-11D-169-C2-R0. This combination ensures superior thermal performance while ensuring that the total cost of the treatment stays with a reasonable limit.

Overall, ATS-11D-169-C2-R0 is a very cost effective and efficient thermal solution for electrical & electronic devices. Its simple, low profile design makes it suitable for many applications, while the patented one-piece two-clip design ensures easy installation. It has excellent durability, oxidation resistance and thermal transfer properties as well. Proper maintenance and careful design considerations can ensure that it reaches its maximum potential in dissipating thermal energy.

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