| Allicdata Part #: | ATS-11D-181-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-181-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-11D-181-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-11D-181-C1-R0 Heat Sink is a highly efficient thermal solution specifically designed for a range of small to medium-sized heat sources. It features a heat pipe construction that uses fluid or vapor to transfer and dissipate heat away from sensitive components. The design also reduces pressure on the parts being cooled, resulting in a more efficient heat transfer process.
The design of the ATS-11D-181-C1-R0 is based on a single or multiple row of evenly spaced aluminum fins, attached to a base plate. The base plate is designed to absorb and disperse the heat evenly and allow air to circulate around the fins to cool them. The fins are made of superbly efficient aluminum alloy to maximize heat dissipation. The high efficiency of the thermal solution ensures that any heat generated within the device is quickly spread out and dissipated away from the heat source, which in turn helps to keep the operating temperatures low.
The ATS-11D-181-C1-R0 Heat Sink is a great choice for a wide variety of applications including medical technology, industrial automation, automotive, and consumer electronics. It can easily handle the demanding thermal loads of a range of small to medium-sized components including CPUs, GPUs, capacitors, memory chips, transistors, and other heat-generating components. Its large surface area and high efficiency cooling properties make it suitable even for the tightest of spaces and it is also easy to mount and install.
The ATS-11D-181-C1-R0 Heat Sink comes with a wide variety of features to ensure that it is able to handle a variety of applications. These include an aluminum fin set for maximum thermal performance, copper heat pipes for rapid heat dissipation, a nickel-plated base for better durability, and an optional mounting bracket for easier installation. All of these features and more make the ATS-11D-181-C1-R0 the perfect choice for your thermal solutions.
The specific data is subject to PDF, and the above content is for reference
ATS-11D-181-C1-R0 Datasheet/PDF