ATS-11D-186-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.90°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:
The ATS-11D-186-C3-R0 is a thermal heat sink solution designed for a wide range of applications. It uses a variety of technologies to manage and regulate heat generated by electronics and other electrical equipment. This ensures efficient operation and protection of the devices and components being used. The ATS-11D-186-C3-R0 is a cost-effective, reliable solution for many types of applications.

Application Field:
The ATS-11D-186-C3-R0 is an ideal thermal heat sink solution for medium- to high-power electronics in a wide range of applications. These include power supplies, LED lighting, tablet/notebook computers, industrial machinery, medical equipment, communications/network devices, server racks, and avionics. In these applications, the ATS-11D-186-C3-R0 can effectively manage and distribute heat generated by the device, helping to improve reliability and performance. It is also designed to be easily integrated into a variety of products.

Design Features:
The ATS-11D-186-C3-R0 is designed to provide reliable and efficient thermal management for a variety of devices and components. It features a thick profile with a solid contact surface for better heat conduction and a low profile for increased airflow. It also has an extended base that ensures a more uniform air flow, which helps keep temperatures under control. The heat sink has a ribbed construction for increased heat dissipation capacity and is equipped with an integrated fan to help reduce temperatures.

Performance:
The ATS-11D-186-C3-R0 has been designed with efficiency and performance in mind. It is capable of dissipating up to 250 watts of heat, making it suitable for even high-power applications. The heat sink is capable of dissipating heat at a rate of 10°C (18°F) per 1.2 watts, providing better cooling performance than comparable solutions. The fan integrated into the heat sink helps reduce temperatures even more. The fan runs at up to 2800 RPM and has a noise level of just 20dBA, making it relatively quiet even at high speeds.

Working Principle:
The ATS-11D-186-C3-R0 works by conducting heat away from its surface and dispersing it through its ribbed design. This helps reduce the temperatures of the heated components and prevents them from overheating. The fan integrated into the heat sink helps to further reduce temperatures, drawing in cool air and pushing hot air away. The fan is designed to run automatically at set temperatures, so it can cool down heated components without user intervention.

Conclusion:
The ATS-11D-186-C3-R0 is an efficient and cost-effective solution for managing the heat generated by a wide range of devices. It is designed to dissipate up to 250W of heat and has an integrated fan that runs automatically at set temperatures, helping to reduce temperatures even further. It is an ideal solution for medium- to high-power electronics in a variety of applications.

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