ATS-11D-190-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS19184-ND

Manufacturer Part#:

ATS-11D-190-C2-R0

Price: $ 4.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11D-190-C2-R0 datasheetATS-11D-190-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.37220
10 +: $ 4.25628
25 +: $ 4.02016
50 +: $ 3.78365
100 +: $ 3.54715
250 +: $ 3.31068
500 +: $ 3.07420
1000 +: $ 3.01508
Stock 1000Can Ship Immediately
$ 4.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.62°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks have been widely used in many aspects of today\'s technology, due to their ability to dissipate heat from components such as CPUs and transistors. ATS-11D-190-C2-R0 is a special type of thermal energy management device, designed to provide optimal temperature control for such components. In this article, we\'ll discuss the application field and workings of the ATS-11D-190-C2-R0.

The ATS-11D-190-C2-R0 is a highly specialized heat sink that is designed for various applications. It can be used as a direct contact heat sink for power semiconductors, providing efficient heat dissipation with a reduced component drag. It can also be used as a controller for electronic components, allowing for improved temperature management for computers, cooling fans, air conditioners, and more. In addition, the ATS-11D-190-C2-R0 is also suitable for applications where vibration-damping and noise attenuation are important, such as in audio and video systems.

The ATS-11D-190-C2-R0 is made up of a combination of materials and components, including aluminum, copper, steel, and plastic. Aluminum is used for its thermal conductivity and excellent heat dissipation characteristics. Copper is used for its high electrical conductivity, while steel is chosen for its high strength and durability. The plastic components, meanwhile, provide lubrication, insulation, vibration dampening, and noise attenuation.

The ATS-11D-190-C2-R0 is designed to manage temperatures with an efficient design that allows both for its air-cooled and liquid-cooled operation. When air-cooled, the heat sink dissipates the heat by dispersing it into the surrounding air, with the airflow further enhancing the cooling efficiency. For liquid-cooled operations, the ATS-11D-190-C2-R0 uses an all-enclosed liquid cooling system, with the liquid circulating within the heat sink itself, providing efficient removal of the heat from the component.

The ATS-11D-190-C2-R0\'s cooling features and design make it suitable for multiple applications, including industrial equipment, over-clocking PCs, and servers. It is also popular for over-clocking CPUs, allowing for improved performance of the CPU, while still keeping it at a safe temperature. In addition, the device is certified for use in many different types of networks, including 10/100/1000 Ethernet, telecom, and industrial control applications.

The ATS-11D-190-C2-R0 is highly efficient and has a long lifespan, ensuring that it is a reliable and durable product. It is also easy to install, as its components can be quickly and easily assembled, which allows for rapid setup and installation. Furthermore, the ATS-11D-190-C2-R0 is highly customizable, as its components can be replaced and upgraded according to the user\'s specific requirements.

To summarize, the ATS-11D-190-C2-R0 is a highly specialized thermal energy management device designed for various applications, such as CPU over-clocking, industrial control, 10/100/1000 Ethernet, and telecom. It is made up of a combination of materials, including aluminum, copper, steel, and plastic, that allow for efficient heat dissipation and thermal management. The ATS-11D-190-C2-R0 is highly efficient and has a long lifespan, making it a reliable and durable product. It is also easy to install and highly customizable, which makes it suitable for multiple applications.

The specific data is subject to PDF, and the above content is for reference

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