ATS-11D-210-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.17°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11D-210-C1-R0 Introduction

The ATS-11D-210-C1-R0 thermal heat sink is a thermally conductive cooling device specifically designed to conduct heat away from electronic components. This type of thermal heat sink is typically used when a component requires cooling due to high levels of power dissipation.

Application Field of ATS-11D-210-C1-R0

The ATS-11D-210-C1-R0 is designed for a wide variety of industrial and commercial applications, such as server rooms, data centers, networking equipment and other high-heat generating electronic components. The ATS-11D-210-C1-R0 is designed to handle up to 28 amps of continuous power up to 110 degrees Celsius.

Working Principle of ATS-11D-210-C1-R0

The ATS-11D-210-C1-R0 works by transferring heat away from a hot component. This is done through a combination of convection, which is the transfer of heat by air circulation, and conduction, which is the direct transfer of heat.Convection occurs when air is drawn in from all sides of the heat sink and then drawn away by a fan or other cooling device. As the air passes over the heat sink it picks up the heat on its way out. This air then travels around the enclosure before leaving the device and taking the heat with it.Conduction, meanwhile, occurs when heat is transferred directly between two objects. In the case of the ATS-11D-210-C1-R0, this occurs when the heat sink absorbs the heat from the hot component. The heat is then transferred from the heat sink to the surrounding air by conduction.

Advantages of ATS-11D-210-C1-R0

The ATS-11D-210-C1-R0 is lightweight and easy to install. The heat sink is also very effective at cooling, with a maximum temperature rise of only 1.5 degrees Celsius over an ambient temperature of 25 degrees Celsius. This allows the component to operate at much higher temperatures than it normally would. The heat sink is also highly efficient, reaching its peak cooling performance quicker than many other designs.

Conclusion

The ATS-11D-210-C1-R0 thermal heat sink is an ideal cooling solution for commercial and industrial applications. Its combination of convection and conduction make it highly effective at cooling even the hottest components, while its lightweight design and easy installation make it simple to use.

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