| Allicdata Part #: | ATS-11D-32-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-32-C1-R0 |
| Price: | $ 5.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-32-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.71933 |
| 30 +: | $ 4.45704 |
| 50 +: | $ 4.19492 |
| 100 +: | $ 3.93271 |
| 250 +: | $ 3.67053 |
| 500 +: | $ 3.40835 |
| 1000 +: | $ 3.34281 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATs-11D-32-C1-R0 is a device typically found in thermal solutions such as heat sinks. It is designed to provide efficient heat transfer from hot components in order to maintain optimal temperatures. This helps to prevent overheating of components which could lead to a malfunction or damage. Heat sinks are usually made up of a network of metal fins or plates connected to a heat source. Heat from the source is dissipated and redistributed through the fins or plates and away from the heat source.
ATs-11D-32-C1-R0 works by utilizing a combination of natural convection and forced convection to transfer and dissipate the heat. Natural convection occurs when hot air rises and rises, and the cooler air falls. This creates an airflow and circulation which plumes up around the fins or plates and helps distribute the heat away from the source. Forced convection helps to increase the natural convective flow by using a fan. Fans are used to create additional pressure over the fins and to push air through the fins and plate.]
The primary application fields for ATs-11D-32-C1-R0 are high power electronic components such as CPUs and GPUs. Devices such as these require effective heat dissipation in order to achieve peak performance. Other applications can include computers, networking devices, medical equipment, automotive electronic components, and industry automation systems.
ATs-11D-32-C1-R0 is typically used in conjunction with other devices such as heat-sink paste, fans and coolers. Heat-sink paste is applied to the device to create a physical barrier between the device and the fins or plates, allowing better air contact. Fans are used to create additional pressure to push the hot air through the fins, while air or water coolers are used to create additional convective flow and dissipation of heat away from the device.
ATs-11D-32-C1-R0 is a reliable and efficient form of thermal management for high performance devices and components. It is an integral part of any thermal solution, helping to maintain optimal temperatures and prevent damage or malfunction of components due to overheating. It is a low cost and easy to use device which provides highly effective heat transfer and dissipation.
The specific data is subject to PDF, and the above content is for reference