ATS-11D-65-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS19238-ND

Manufacturer Part#:

ATS-11D-65-C2-R0

Price: $ 4.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11D-65-C2-R0 datasheetATS-11D-65-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.37220
10 +: $ 4.25628
25 +: $ 4.02016
50 +: $ 3.78365
100 +: $ 3.54715
250 +: $ 3.31068
500 +: $ 3.07420
1000 +: $ 3.01508
Stock 1000Can Ship Immediately
$ 4.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management can be an issue in the operation of a variety of electrical components. Proper cooling ensures better performance of hardware and it extends the lifespan of the parts being used. The ATS-11D-65-C2-R0 thermal heat sink can help achieve this level of cooling, and this article will explain the applications and principles governing it.

Heat sinks are an essential component of both active and passive heat transfermechanisms. Their primary purpose is to absorb heat from other components and dissipate it into the surrounding environment. They help regulate system temperatures by drawing unwanted heat from components, and in turn, increasing their efficiency and life.

The ATS-11D-65-C2-R0 thermal heat sink is designed for use in both mounting heatsinks and fanless cooling systems. The sink features a copper face which disperses heat away from the component and into the surrounding air. It is also outfitted with multiple aluminum fins to maximize its cooling capacity. The sink is designed to fit on top of a flat surface, allowing convenient placement toward the source of heat. The copper face also offers superior heat-transfer characteristics, which helps ensure that the component remains cool at all times.

The ATS-11D-65-C2-R0 thermal heat sink is suitable for use with a variety of electronic components and devices such as processors, transistors, integrated circuits, and more. Its copper face and aluminum fins provide excellent thermal resistance, making it a good choice for cooling components that generate heat. The sink is also designed for use in a variety of different mounting configurations, allowing it to be used with fans, enclosed systems, liquid cooling systems, and other mechanisms.

The ATS-11D-65-C2-R0 thermal heat sink is also a popular choice due to its low cost and easy installation. It does not require an expensive cooling system or elaborate wiring. This allows users to quickly and easily install the sink on their components and enjoy the benefits of heat transfer without the hassle. Additionally, the sink offers superior cooling performance for its size, making it a great option for most cooling requirements.

In terms of its working principle, the ATS-11D-65-C2-R0 thermal heat sink functions through convection. The sink is made out of materials that can effectively draw heat from the component it is installed on and dissipate it into the atmosphere. The aluminum fins of the sink increase its cooling capacity by increasing the surface area available to absorb heat. The copper face also helps to draw heat from the component and disperse it into the atmosphere more efficiently.

In summary, the ATS-11D-65-C2-R0 thermal heat sink is an effective solution to cooling electronic components. Its copper face and aluminum fins ensure superior cooling performance, and it is easy to install and affordable. The sink functions through convection and can be used with a variety of different mounting configurations. It is an excellent option for anyone looking for a reliable and affordable way to manage their electronic component temperatures.

The specific data is subject to PDF, and the above content is for reference

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