| Allicdata Part #: | ATS-11D-75-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-75-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-75-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are integral components to many electronic applications, as they help dissipate excess heat generated by components in order to maintain optimal performance and function. The ATS-11D-75-C1-R0 is a commonly used heat sink, designed to provide both direct and indirect cooling to multiple components in electronic applications. This section will focus on discussing the application field and working principle of the ATS-11D-75-C1-R0.
Application Field of the ATS-11D-75-C1-R0
The ATS-11D-75-C1-R0 is used in a variety of electronic applications. It is particularly suitable for thermal management in military and aerospace applications, as its robust construction ensures reliable performance in extreme environmental conditions. The unit is capable of dissipating heat from components at high temperatures, making it suitable for high performance applications. Other applications include medical devices, consumer electronics interfaces, and automotive electronics.
Working Principle of the ATS-11D-75-C1-R0
The ATS-11D-75-C1-R0 is designed to take advantage of both direct and indirect cooling methods. Its design involves metal heat spreaders, air channels, and fans. Metal heat spreaders are designed to absorb the heat from the components and transfer it to the air channels. The air channels then direct the heat away from the components and to the fans. The fans then move the hot air away from the components and dissipate it into the surrounding environment. This process of heat dissipation is known as convection cooling.
The ATS-11D-75-C1-R0 is also designed to operate with minimal noise, making it suitable for noise sensitive applications. Additionally, the unit is designed for efficient heat dissipation, ensuring optimal performance for any application it is used in. All of this makes the ATS-11D-75-C1-R0 an ideal choice for thermal management in a variety of electronic applications.
Conclusion
The ATS-11D-75-C1-R0 is a commonly used heat sink designed for thermal management in a variety of electronic applications. It is particularly suitable for military and aerospace applications, as it is designed to withstand extreme environmental conditions and provide reliable performance. The unit is also designed for efficient heat dissipation, and operates with minimal noise, making it suitable for even noise sensitive applications. In summary, the ATS-11D-75-C1-R0 is an excellent choice for thermal management in a variety of electronic applications.
The specific data is subject to PDF, and the above content is for reference