| Allicdata Part #: | ATS-11D-81-C3-R0-ND |
| Manufacturer Part#: |
ATS-11D-81-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-81-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11D-81-C3-R0 thermal heat sink is designed to dissipate large amounts of heat from electronic components. It is a versatile component that can be used in both cooling and heating applications. It is typically used in industrial, medical, and military applications.
The ATS-11D-81-C3-R0 consists of a base, fins, and two top caps. The base of the heat sink is made from high-quality aluminum and has a black anodized finish. The fins are also constructed from aluminum and are designed to maximize the surface area available for heat dissipation. The two top caps are made of stainless steel and are designed to securely close the heatsink.
The primary purpose of a thermal heat sink is to reduce the operating temperature of the components housed inside it. Heat is expelled from the components and absorbed by the fins of the heatsink. This heat is then carried away from the component by the heat sink. The air surrounding the component is then cooled, lowering its temperature.
The ATS-11D-81-C3-R0 is especially useful for applications that require larger heat sinks. The larger surface area of the heat sink allows for greater amounts of heat dissipation than could be achieved with a smaller heat sink. The fins also provide increased airflow around the components, further reducing the operating temperature.
The ATS-11D-81-C3-R0 can also be used in cooling applications. The aluminum fins are designed to draw heat from the environment and expel it away from the components. This can help to reduce operating temperatures, allowing components such as processors and graphics cards to function more efficiently.
The ATS-11D-81-C3-R0 is an effective solution for reducing the operating temperatures of components. It combines the benefits of a larger surface area with increased airflow to provide superior thermal performance. It is especially useful for small, high-power components where space and efficient cooling are essential.
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