| Allicdata Part #: | ATS-11D-87-C1-R0-ND |
| Manufacturer Part#: |
ATS-11D-87-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11D-87-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of any electronic system design. The ATS-11D-87-C1-R0 is a high-performance heat sink designed for applications in high-heat environments and in extreme temperatures. The heat sink is designed to dissipate heat away from sensitive components and electronics, allowing components to operate at peak performance and reliability without overheating.
The ATS-11D-87-C1-R0 has a low profile design, is lightweight, and can be installed in a variety of orientations. This allows the heat sink to be maximized in space-restricted applications. The aluminum fins are stacked tightly in a concentric pattern, and the fins surface is coated with a black anodize finish. This helps to improve heat transfer and increase heat dissipation. In addition, the heat sink is ventilated on both sides to promote air circulation, which further improves heat dissipation.
The ATS-11D-87-C1-R0 is designed to work in conjunction with a fan, or other heat-dissipating mechanism, such as a larger air or liquid cooling system, to ensure that maximum heat dissipation is achieved. The fan is stationary and operates at constant speeds, using its air pressure to ensure high performance thermal solutions. The fan is designed to maintain laminar airflow within the fins of the heat sink, allowing for greater surface area contact with the cooling medium.
In addition, the ATS-11D-87-C1-R0 is designed to be installed directly onto heat-sensitive components, as it can effectively absorb and remove heat from the component, allowing it to operate at its optimal performance. The heat sink allows for a high level of cooling efficiency with minimal power requirements. This allows for long lasting performance and reliability of the heat sink.
The ATS-11D-87-C1-R0 is a versatile thermal management solution and can be used in a wide variety of applications. It is suitable for use in industrial, automotive, telecom, and computer system and applications where efficient heat management is an issue. Additionally, the ATS-11D-87-C1-R0 is a cost-effective solution and can be used to significantly reduce the total cost of ownership for electronic components.
As the demand for efficient thermal management systems increases, the ATS-11D-87-C1-R0 is a solid option for providing reliable and efficient cooling in extreme temperatures. The low profile design, lightweight construction and efficient cooling are major advantages of the ATS-11D-87-C1-R0 heat sink. Additionally, the simple installation and ease of use of the ATS-11D-87-C1-R0 makes it a valuable solution for any application requiring efficient thermal management.
The specific data is subject to PDF, and the above content is for reference