ATS-11E-05-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11E-05-C1-R0-ND

Manufacturer Part#:

ATS-11E-05-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11E-05-C1-R0 datasheetATS-11E-05-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.69°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are components that help manage temperatures in various electrical and electronic devices. As power increases in the devices, heat levels can get extremely high and can cause major problems. A thermal-heat sink works to disperse and dissipate the excess heat and keep the temperature within manageable limits. This allows the device to work more efficiently without any overheating.

The ATS-11E-05-C1-R0 thermal-heat sink is a powerful and efficient way to manage temperatures in various electrical and electronic devices. It is designed to provide high-performance cooling and has been tested to work in the most extreme environments without any compromise on safety or performance. The ATS-11E-05-C1-R0 thermal-heat sink has a wide range of application fields and is used in many different types of electronic devices. It is used in computer cooling systems, power supplies, high-energy systems, and in concert with many other electronic components.

The ATS-11E-05-C1-R0 thermal-heat sink is a highly efficient passive component that operates by dissipating heat away from the source. It is constructed with a base plate that is insulated on either side with a foil-backed material. Heat is then dissipated away from the source thanks to the thermal-heat sink’s highly efficient cooling technology. The thermal-heat sink’s design also makes it easy to install and expand across a range of applications fields. It contains various sizes and designs, as well as a range of mounting options.

The ATS-11E-05-C1-R0 thermal-heat sink is highly versatile and is used in many different types of applications. It can be used in power supplies, high-energy systems, computers, and many other electronic devices. It provides excellent heat management and helps reduce temperatures to prevent any potential damages to the device. The thermal-heat sink features a wide operating temperature range of -50°C to +150°C and can be used in a wide variety of environments.

The ATS-11E-05-C1-R0 thermal-heat sink is also highly efficient and features low thermal resistance. This is important in ensuring maximum cooling performance and making sure that the electronic device is operating at optimal temperatures. The thermal-heat sink is also highly reliable with a long product life and can be used on a variety of applications.

Overall, the ATS-11E-05-C1-R0 thermal-heat sink is an ideal solution for managing temperatures in various electronic devices. It is highly efficient and reliable and provides excellent performance in a wide range of applications. The thermal-heat sink can also be easily installed and expanded, making it a great choice for many types of applications. With its high efficiency, wide range of application fields, and reliable performance, the ATS-11E-05-C1-R0 thermal-heat sink is the perfect solution for managing and controlling temperatures in a variety of electrical and electronic devices.

The specific data is subject to PDF, and the above content is for reference

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