| Allicdata Part #: | ATS-11E-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-11E-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are an integral component of many electrical applications. The ATS-11E-10-C3-R0 is a high-performance heat sink designed for applications requiring dynamic temperature control. This model offers superior performance and reliability in a cost-effective package.
The ATS-11E-10-C3-R0 is designed to provide adequate thermal transfer from a variety of electrical components, including those with high-power semiconductor components. To ensure optimal cooling performance, the ATS-11E-10-C3-R0 features a unique fin structure that is optimized to dissipate heat quickly and evenly. The fins also feature a special high-temperature coating that increases the efficiency of the heat transfer process.
The ATS-11E-10-C3-R0 is designed for a wide variety of applications, including computers, communications networks, industrial control systems, and medical equipment. The device is also suitable for cooling medium to high-power components such as power transistors, power diodes, and other high-power components.
The ATS-11E-10-C3-R0 is versatile and can be used as either a primary or secondary heat sink. When used as a primary heat sink, the device offers superior performance and reliability due to its superior thermal properties. When used as a secondary heat sink, the device can be used to supplement the primary heat sink and provide additional cooling for higher power components.
To ensure optimal performance, the ATS-11E-10-C3-R0 is designed with several features. The heat sink features a large fin area that allows for efficient heat transfer. The fins are also designed to ensure uniform heat distribution across the component. The device also features an internal fan and active air convection to ensure optimal airflow.
The ATS-11E-10-C3-R0 features several other features that enhance its performance. These features include adjustable mounting brackets that allow for quick and easy installation, as well as an adjustable power supply voltage switch. The device has a low-noise fan with rubber fan pads for noise reduction.
The ATS-11E-10-C3-R0\'s working principle is based on the transfer of thermal energy from a heat source to a cooler temperature environment. As the device transfers heat from the component, the temperature of the surrounding environment decreases. The device\'s unique design and fin structure ensure that the heat is dissipated quickly and evenly. This ensures that the thermal energy is spread across the component to ensure optimal cooling performance.
The ATS-11E-10-C3-R0 is an ideal choice for applications that require superior thermal management capabilities. Its innovative design and fin structure ensure that the device provides optimal cooling performance in a cost-effective package. This makes the device ideal for use in a wide variety of applications and makes it an ideal choice for applications that require dynamic temperature control.
The specific data is subject to PDF, and the above content is for reference