| Allicdata Part #: | ATS19312-ND |
| Manufacturer Part#: |
ATS-11E-127-C2-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-127-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.12650 |
| 10 +: | $ 4.01373 |
| 25 +: | $ 3.79058 |
| 50 +: | $ 3.56769 |
| 100 +: | $ 3.34473 |
| 250 +: | $ 3.12175 |
| 500 +: | $ 2.89877 |
| 1000 +: | $ 2.84303 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are designed to effectively dissipate heat generated by electronic devices and components, and the ATS-11E-127-C2-R0 is no exception. This passive-cooling device is mainly used to cool components of computers and other electronic equipment that are prone to heat buildup, such as processors, graphics cards, and other crucial parts.
The ATS-11E-127-C2-R0 consists of an aluminum fin absorbing plate, an aluminum profile extrusion section, and a heat pipe. The heat pipe is a thin copper tube containing a liquid which circulates and is responsible for transporting heat away from the component or device onto the metal fins to dissipate it.
The aluminum fin-absorbing plate, also known as a fin stack, is a series of thin fins that are connected and help dissipate heat more quickly and efficiently. The fins are aligned in such a way that air can easily flow through them, allowing heat to be dissipated faster. There is also a thermal adhesive material between the plate and the aluminum extrusion section, which helps to further improve the heat transfer.
In addition, the ATS-11E-127-C2-R0 features a thermostat and temperature sensor to monitor temperature and activate the cooler if needed. The device also has built-in cooling fan(s) and heat pipes that can be used to further improve cooling performance.
The ATS-11E-127-C2-R0 is designed to be a highly efficient and easy to install thermal solution. It helps to improve the reliability and performance of electronic components and devices, keeping them cool and operating at their peak. Installing this thermal solution helps to prolong the life of the device and ensure optimal operation.
The specific data is subject to PDF, and the above content is for reference