ATS-11E-140-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-11E-140-C2-R0: Thermal - Heat Sinks

Thermal - Heat Sinks are electronic components designed to transfer heat away from sensitive components from an electronic device. The ATS-11E-140-C2-R0 is a Thermal - Heat Sink specifically designed to help protect an electronic device from thermal damage.This specific Heat Sink is made of aluminum fins and a copper base in order to effectively transfer and dissipate heat away from devices in a wide variety of applications. It also features a high airflow thermal resistance and very low thermal resistance combined with optimized fin heights and profiles. This enables it to be highly efficient at transferring heat away from whatever components are attached.The ATS-11E-140-C2-R0 is a very versatile Heat Sink with a wide range of applications in the control, power, DC to DC, and high-current AC switching markets. It can be used to protect any kind of electronic device from damage caused by thermal overload. Additionally, its efficient design means that even with high power applications, it helps to keep temperatures at a safe level which makes it ideal for higher power devices.Due to its high efficiency and low thermal resistance, this Heat Sink is ideal for situations where it needs to help dissipate a large amount of heat. It is perfect for applications like enclosures for heated tools, welding machines, drives and motor control, and other general-purpose applications.The ATS-11E-140-C2-R0 Heat Sink also helps reduce system noise by dissipating excess heat away from components and transferring it to the environment. This makes it perfect for applications at higher temperature levels, as it helps to keep a stable temperature by reducing any temperature spikes in the system.This Thermal - Heat Sink also features a rumbled texture on its surface, which helps to minimize airflow resistance and increases overall air circulation through the fins. This helps transfer additional heat away from the device, resulting in a more efficient performance.The fins on the ATS-11E-140-C2-R0 are also designed with optimized angles of attack in order to ensure maximum heat transfer efficiency. By optimizing the angles of the fins, the Heat Sink is able to keep the components at a much lower temperature than if the angles were not optimized.In conclusion, the ATS-11E-140-C2-R0 is an excellent Heat Sink for a variety of applications. It is designed to transfer and dissipate heat away from sensitive components from an electronic device. It\'s highly efficient design, rumbled texture, and optimized fin angles of attack make it perfect for high power electronic devices that require a high level of thermal control.

The specific data is subject to PDF, and the above content is for reference