
Allicdata Part #: | ATS-11E-145-C1-R0-ND |
Manufacturer Part#: |
ATS-11E-145-C1-R0 |
Price: | $ 3.60 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X30MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.26907 |
30 +: | $ 3.18087 |
50 +: | $ 3.00422 |
100 +: | $ 2.82744 |
250 +: | $ 2.65074 |
500 +: | $ 2.56237 |
1000 +: | $ 2.29730 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management technologies are an essential part of modern life. They regulate the temperature of electrical and electronic components, ensuring that they operate safely in their intended environment. The ATS-11E-145-C1-R0 is a heat sink specifically designed for aerial and satellite applications, with a potential use in multi-frequency civil and military architectures. This article outlines the features and benefits of the ATS-11E-145-C1-R0, and its application field and working principle.
The ATS-11E-145-C1-R0 is a thermal management device specifically designed for use with high frequency components, such as amplifiers, transceivers, receivers, and transmitting antennas. It has an aluminum body and a black electro-coated steel base for increased rigidity and protection, making it highly durable and reliable. The product is available in an array of sizes with an optimized weight for any application. An additional feature of this device is the use of “rounded” fins, which allow for increased heat transfer and a greater surface area for the device to dissipate heat. This makes it perfect for use in businesses and applications where a high performance and reliable heat sink are essential.
The primary purpose of this device is to regulate the temperature of components, and improve the operation of the device by ensuring that the components are not overheated. This is accomplished through the efficient transfer of thermal energy, from the component to the device\'s large surface area. The large surface area also helps to reduce the overall temperature of the components by dissipating heat quickly and evenly. By reducing the temperature of components, users can experience improved performance and increased reliability from their electrical and electronic components.
In addition to temperature regulation, the ATS-11E-145-C1-R0 has several other uses which make it the ideal choice for use in aerial and satellite applications. As well as aiding in temperature regulation, the product can also serve to provide protection from vibration, shock, and environmental impacts, making it an extremely robust and reliable device for outdoor use. The device’s large size also allows for greater distance between components, ensuring that they are better able to withstand high frequencies or other aggressive environmental conditions. Furthermore, due to its unique design, the device can also enhance the performance of bandwidth or frequency applications by aiding in signal attenuation.
The ATS-11E-145-C1-R0 is a simple and effective means of ensuring that electrical and electronic components are kept at an optimal operating temperature. Through its combination of thermal regulation, vibration and shock resistance, and signal attenuation, the device offers users the perfect solution for any aerial or satellite application. This thermal management device is an excellent choice for any user looking for a reliable, durable, and cost-effective heat sink. Its relatively small size, large surface area, and capacity are the perfect combination for increasing performance and reliability of electrical and electronic components.
The specific data is subject to PDF, and the above content is for reference