| Allicdata Part #: | ATS-11E-156-C1-R0-ND |
| Manufacturer Part#: |
ATS-11E-156-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-156-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used for thermal management to help keep electronic and optical components cool. Heat sinks are also used extensively in backplanes and other telecommunications and computer equipment, and in cable modem systems. They are typically made from aluminum, but can also be made from various other materials such as copper or even plastic.
The ATS-11E-156-C1-R0 is a popular heat sink model that is used in a variety of applications today. This heat sink comes in two versions: a lower profile variant and a higher profile variant. It provides a cooling capacity of 0.270W/K with a 25mm air gap, making it suitable for a wide range of applications.
The ATS-11E-156-C1-R0 is commonly used in applications such as telecommunications and computer equipment, LED lighting, and power adapters. It is most commonly used in devices such as laptops, desktop computers, game consoles, tablets, and servers. It is also commonly used in telecom switchboards, cable modems, and industrial and medical equipment.
The ATS-11E-156-C1-R0 works by dissipating heat away from the surface of the component. In doing so, it brings the component to a temperature lower than the surrounding environment. This heat sink is designed with an integrated fan that draws in air and circulates it across the heat sink body. The heat is then expelled into the surrounding environment from the fins on the heat sink.
The ATS-11E-156-C1-R0 also uses multiple design features to maximize cooling performance. The fan blades are carefully designed to optimize air flow, while the heat sink body is designed to maximize surface contact and surface area. Furthermore, the heat sink is designed with a cross-cut fin design to increase the heat dissipation surface area and air velocity. This allows the fan to move more air over the heat sink, resulting in more efficient cooling.
Overall, the ATS-11E-156-C1-R0 is a versatile and efficient thermal management tool. Its design is optimized for a wide range of applications in the telecommunications and computer industries. The heat sink draws in air and circulates it across the heat sink body, resulting in more efficient cooling. It also features a cross-cut fin design and integrated fan, helping to further optimize its cooling performance.
The specific data is subject to PDF, and the above content is for reference