| Allicdata Part #: | ATS-11E-164-C1-R0-ND |
| Manufacturer Part#: |
ATS-11E-164-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-164-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of electronic system design. Efficient heat dissipation is essential to ensure the reliability and performance of electronic components. ATS-11E-164-C1-R0 is one of the most popular and cost-effective thermal solutions used in the design of high-performance systems.
The ATS-11E-164-C1-R0 thermal solution is made up of a heat sink, fan, and shroud assembly. The heat sink is constructed from all-aluminum alloy material and is designed for optimal thermal performance. Its fins are engineered to provide maximum surface area which accelerates the transfer of heat away from components.
The fan is designed to deliver maximum airflow with minimal noise. It is installed in a shroud to ensure that the air is distributed evenly across the entire heat sink. This ensures that all components are cooled efficiently. The fan also features a variable speed control which allows the user to adjust the fan speed to their specific needs.
The ATS-11E-164-C1-R0 thermal solution is used in many different types of applications, including servers, graphics cards, data storage systems, and communications systems. In all of these applications, its heat sink and fan assembly provide effective thermal management. In addition, the fan can be adjusted to vary the fan speed according to the needs of the system. This ensures that the system is never under-cooled or over-cooled.
The working principle of the ATS-11E-164-C1-R0 heat sink and fan assembly is based on the theory of thermodynamics. Heat is generated by the components in the system and the heat is transferred to the surrounding environment. The heat sink and fan assembly provide physical barriers between the heated components and the outside environment. This helps to slow the heat transfer process and prevents components from overheating.
The fan speed is also critical to efficient heat dissipation. A higher fan speed increases air circulation and reduces the overall operating temperature of components. The shroud also acts as an insulator, helping to prevent the air from escaping and direct it where it is most needed.
The ATS-11E-164-C1-R0 thermal solution is an effective and cost-efficient solution for high-performance system design. It is designed for optimal thermal management efficiency while delivering low noise performance. The heat sink and fan assembly provides a physical barrier between heated components and the surrounding environment, helping to reduce the temperature of the components and ensure reliable performance.
The specific data is subject to PDF, and the above content is for reference