| Allicdata Part #: | ATS-11E-169-C1-R0-ND |
| Manufacturer Part#: |
ATS-11E-169-C1-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-169-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management systems are designed to control and manage the temperature of various electronic components. One of the more popular solutions, especially for larger and higher-power components, is the use of heat sinks. ATS-11E-169-C1-R0 thermal heat sinks are one of the more popular options of heat sink available on the market.
Heat sinks are designed to lower the temperature of an object or component by increasing the surface area of the component, allowing the air to dissipate more of the heat. Generally speaking, a heat sink consists of two main components: a metal body, which can be made from a variety of metals such as aluminum; and a series of fins, which run through the body. The fins are designed to be parallel to each other to maximize surface area and air contact.
The ATS-11E-169-C1-R0 thermal heat sink is a thermal management unit specifically designed for applications requiring the highest levels of thermal performance. It is designed to work in both air-cooled and liquid-cooled systems and is a highly efficient thermal resistor element. The thermal construction of the ATS-11E-169-C1-R0 thermal heat sink is designed to maximize heat transfer, providing an extremely efficient heat dissipating solution.
The design of the ATS-11E-169-C1-R0 thermal heat sink allows for a high level of air flow, delivering a higher level of thermal performance than other similar products. The design of the fins also ensures that the air flow is evenly distributed across the surface of the heat sink and is designed to minimize hot spots.
The ATS-11E-169-C1-R0 thermal heat sink can be used in a wide range of applications. It is often used in high-powered systems, where large amounts of heat must be dissipated in a relatively short amount of time. It is also capable of operating in both air-cooled and liquid-cooled environments, providing great flexibility for users.
The ATS-11E-169-C1-R0 thermal heat sink is an efficient and lightweight solution for controlling and managing thermal temperatures in a variety of devices and applications. It is designed to reduce temperatures in high-powered systems and is designed with maximum thermal resistance in mind. This thermal management solution is one of the most efficient options available on the market and is an ideal solution for providing high-performance thermal performance.
The specific data is subject to PDF, and the above content is for reference