| Allicdata Part #: | ATS-11E-198-C3-R0-ND |
| Manufacturer Part#: |
ATS-11E-198-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-198-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an integral part of our daily lives. Thermal components such as heat sinks, cooling fans, air-to-air and air-to-liquid exchangers, among other thermal products are utilized to manage the temperature of various electrical and electronic components. ATS-11E-198-C3-R0 happens to be one such incredible thermal component that belongs to the heat sink family.
ATS-11E-198-C3-R0 is an exceptionally versatile thermal component that provides outstanding thermal performance in the most compact space. This heat sink utilizes patented Micro Extrusion technology for its construction which results in excellent thermal capacity at a very slim profile. Such a characteristic makes it extremely ideal for installations in small, tight, and confined spaces.
When it comes to application field, ATS-11E-198-C3-R0 is majorly used in small envelopes and electronic packages. It is perfect for applications like laptop and tablet computers, mobile phones, LED lighting, and game consoles. This heat sink is also a great choice for applications where the heat source requires lower airflow, such as thermal interface materials.
This incredibly efficient thermal component works on the principle of conduction. Heat is transferred from the heat source to the heat sink via direct contact. The heat sink has a flat surface on one side, which in contact with the heat source, absorbs the heat from it. This heat is then dissipated by the heat sink into the surrounding environment, which in turn helps lower the temperature of the heat source.
At the same time, heat sink’s heat spread-fin design enables maximum thermal performance in small space. Its fanned fin design optimizes the surface area and the turbulence of air flowing between the fins and hence helps boost the thermal performance. The aluminum construction of this heat sink also makes it lightweight, robust, and highly durable.
On the whole, ATS-11E-198-C3-R0 is an excellent example of thermal component that is designed to provide maximum thermal performance in minimal space. Its superior construction and heat spread-fin design make it perfect for applications in small envelopes and electronic packages.
The specific data is subject to PDF, and the above content is for reference