ATS-11E-200-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.76°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are a type of device that is used to dissipate heat from a component or system. They are typically used in electronics and computer hardware to prevent overheating. The ATS-11E-200-C1-R0 is a type of Thermal- Heat Sink specifically designed to provide thermal management for small to mid-sized equipment.

Application Field

The ATS-11E-200-C1-R0 is suitable for use in small consumer electronics, such as laptop computers, and in commercial and industrial applications. The device can also be used in vehicles, telecommunications and instrumentation.

Working Principle

The ATS-11E-200-C1-R0 is designed to efficiently dissipate heat from a component or system by conducting it away from the heated source area. The device is made of an aluminum block that is specially designed to facilitate the efficient transfer of heat from the source to its fins.At the core of the device is a thermally conductive metal plate called a "heat spreader", which distributes the heat away from the source to its fins. The fins act as surfaces that collect and dissipate the heat by thermal radiation.The device is also equipped with a fan, which helps to dissipate heat more efficiently. The fan draws in cooler air from outside the device and circulates it over the heat spreader and its fins. As the fan circulates the air, it helps to further convect and dispel the heat.In addition to convective cooling, the ATS-11E-200-C1-R0 is also equipped with a thermoelectric (TEC) element, which further aids in cooling by creating a heat gradient. The TEC element works by absorbing the heat generated from the component or system and then releasing it into the air.

Conclusion

The ATS-11E-200-C1-R0 is an effective thermal-heat sink that is ideal for a wide range of applications. Its combination of efficient heat dissipation, convective and thermoelectric cooling methods ensure that temperatures are kept to a minimum and components are kept safe from overheating. With its versatility and ease of use, the ATS-11E-200-C1-R0 is an ideal choice for anyone looking for an effective, reliable and budget-friendly solution to their thermal management needs.

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