| Allicdata Part #: | ATS-11E-204-C3-R0-ND |
| Manufacturer Part#: |
ATS-11E-204-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-204-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11E-204-C3-R0 is a thermal-type heat sink specifically designed for applications where a reliable and efficient cooling system is essential. Heat sinks provide an effective and economical way to keep electronic devices and components from overheating and thereby maintain their optimal performance. The ATS-11E-204-C3-R0 is designed to dissipate heat away from sensitive integrated circuits, preventing them from burning out and damaging other nearby components due to excessive temperatures.
The ATS-11E-204-C3-R0 is made of aluminum which works as the main material used for its construction. Aluminum is a great heat sink material since it has a high thermal conductivity, meaning it is good at conducting and dispersing heat away from the source quickly and efficiently. The aluminum also has excellent corrosion resistance, making it ideal for long-term use in humid environments and electronics applications. In addition, it is lightweight and easy to install. Moreover, its stable structure and design make it suitable for a wide range of applications.
The ATS-11E-204-C3-R0 also features an optimized working principle. It has been designed to provide efficient cooling and effective heat dissipation. In order to achieve this goal, the heat sink is equipped with an active cooling system which comprises of a fan, fins, heat spreader and heat pipe. The fan draws in cool air from the outside and passes it over the fins to create an airflow which transfers the heat away from the heat spreader and into the heat pipe. The heat pipe, which is filled with a liquid coolant, carries the heat away from the electronic component and dissipates it into the atmosphere. This process allows the heat to be quickly and efficiently removed from the source, thus keeping the component running at optimal performance levels.
The ATS-11E-204-C3-R0 is an ideal device for cooling down sensitive electronic components and can be used in a variety of applications. Its lightweight design, efficient cooling system and corrosion-resistant capabilities make it a perfect solution for industrial and commercial use. It can be used to cool down electronic components such as CPUs, GPUs, storage drives and many more. Its optimized working principle ensures effective heat dissipation and superior cooling capabilities.
The specific data is subject to PDF, and the above content is for reference