
Allicdata Part #: | ATS-11E-209-C1-R0-ND |
Manufacturer Part#: |
ATS-11E-209-C1-R0 |
Price: | $ 5.12 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 70X70X10MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.60341 |
30 +: | $ 4.34784 |
50 +: | $ 4.09210 |
100 +: | $ 3.83632 |
250 +: | $ 3.58057 |
500 +: | $ 3.32481 |
1000 +: | $ 3.26087 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.756" (70.00mm) |
Width: | 2.756" (70.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are vital components in many applications which require efficient heat transfer. They are an essential part of larger machines and help to regulate the temperature of the system. One such product is the ATS-11E-209-C1-R0. This paper looks at the application field and working principle of this thermal product.
Introduction
A Thermal - Heat Sink is a device or component that dissipates, or spreads out, heat generated by a device or system. The ATS-11E-209-C1-R0 is an example of such a device. As a competitively priced product, it can provide a number of benefits and is an excellent heat transfer solution.
ATS-11E-209-C1-R0 Application Field
The ATS-11E-209-C1-R0 is designed for emitter applications in high-end Consumer Electronics, Industrial Control systems, Telecommunication systems, Medical systems, Automotive electronics, Consumer appliances and Lighting applications. The product is capable of a wide range of application areas, including radio frequency and broadband systems, high-power amplifiers, FM bands, television signals, and part of the telecom system.
In addition, the product has a low profile design and is ideal for applications where space is limited. The product is also suitable for applications where efficiency and thermal performance matter. Its ability to deliver heat dissipation has been proven to be effective in applications where temperatures exceed 100 degrees Celsius.
ATS-11E-209-C1-R0 Working Principle
The ATS-11E-209-C1-R0 uses a combination of heat sinks and fans to dissipate heat. Heat sinks are used to absorb heat from a device and then dissipate it by means of a large fan. The fan then uses thermodynamic principles to create a cooling effect. This cooling effect is then used to reduce the temperature of the device or system.
Air is drawn into the fan, which then passes through multiple fins arranged in a circular pattern. The fins absorb the heat from the device and pass it to the fan, which further dissipates it. The air then passes through fins again and is released into the environment. This process of dissipating heat continues until the temperature reduction is achieved.
This combination of air flow and efficient heat exchange gives the product a significant advantage, especially in hot or oily environments that often produce high temperatures.
Conclusion
The ATS-11E-209-C1-R0 is an efficient thermal product designed for a range of applications. Its combination of a low profile design and excellent heat exchange ensures maximum efficiency and thermal performance. Its ability to dissipate heat makes it an excellent choice in applications where temperatures exceed 100° Celsius. The working principle of the product is based on thermodynamics and creates a cooling effect that helps to reduce the temperature of the device or system.
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