| Allicdata Part #: | ATS-11E-21-C1-R0-ND |
| Manufacturer Part#: |
ATS-11E-21-C1-R0 |
| Price: | $ 4.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-21-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.75921 |
| 30 +: | $ 3.55047 |
| 50 +: | $ 3.34152 |
| 100 +: | $ 3.13267 |
| 250 +: | $ 2.92383 |
| 500 +: | $ 2.71499 |
| 1000 +: | $ 2.66278 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a commonly used active component in consumer electronics. They are designed to efficiently dissipate heat away from a hot component, usually an integrated circuit (IC). The most basic type of heat sink is a simple aluminum block, mounted on top of the IC with screws. More advanced forms of heat sinks use heat pipes, or even airflow fans to help the heat dissipate even more efficiently. The ATS-11E-21-C1-R0 is one of the most advanced thermal heat sink designs, and is suitable for use in a wide variety of devices.
The ATS-11E-21-C1-R0 is a large, two stage heat sink. It features a flat base, surrounded by a number of radial arms, which are designed to allow for air circulation around the base and across the surface of the entire heat sink. The base of the heat sink is made from a highly conductive aluminum alloy, which helps to draw the heat away from the component attached to the heat sink. The arms of the heat sink are also made of aluminum, though they are designed to be highly thermally conductive as well.
The primary purpose of the ATS-11E-21-C1-R0 is to dissipate heat away from a particular component. When two components are mounted on a PCB (printed circuit board), it is important to ensure that both components are operating at an optimal temperature. The ATS-11E-21-C1-R0 helps to keep both components, and the PCB itself, from getting too hot. With its large base, and its arm design, the ATS-11E-21-C1-R0 is able to more efficiently dissipate the heat away from the component than normal heat sink designs.
The secondary purpose of the ATS-11E-21-C1-R0 is to reduce EMI (electromagnetic interference) in the surrounding environment. This is done by the use of an EMI shield, which is mounted on the base of the heat sink. This shield is designed to reduce the EMI that is generated by the components, thus reducing any interference with other electronics in the immediate area.
The ATS-11E-21-C1-R0 was designed for use in high end consumer electronics. It is used to cool high speed processors, such as those found in gaming consoles, and other complex electronics. It is also suitable for use in industrial applications, as the large base provides plenty of surface area for dissipating the heat produced by components.
The ATS-11E-21-C1-R0 is a sophisticated thermal heat sink, and provides exceptional performance in a wide variety of applications. Its large base and arm design provide plenty of surface area for dissipating heat, while the EMI shield helps to reduce any interference with nearby electronics. When combined with other cooling solutions, such as fans or heat pipes, the ATS-11E-21-C1-R0 can provide excellent heat dissipation in even the most demanding applications.
The specific data is subject to PDF, and the above content is for reference