| Allicdata Part #: | ATS19408-ND |
| Manufacturer Part#: |
ATS-11E-25-C2-R0 |
| Price: | $ 6.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-25-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.62590 |
| 10 +: | $ 5.47092 |
| 25 +: | $ 5.16726 |
| 50 +: | $ 4.86322 |
| 100 +: | $ 4.55925 |
| 250 +: | $ 4.25530 |
| 500 +: | $ 3.95135 |
| 1000 +: | $ 3.87536 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential elements of modern aelectronics systems. By capturing and dissipating thermal energy produced by an electronic device or component, they ensure that the device or component functions properly. The ATS-11E-25-C2-R0 is a commercially available, low-power, small-footprint thermal heat sink from Wakefield-Vette. The ATS-11E-25-C2-R0 offers many benefits over traditional heat sinks, making it ideal for a wide range of electronics cooling applications.
Applications
The ATS-11E-25-C2-R0 is designed to cool a variety of electronic components, such as CPUs, FPGAs, GPUs, RAM, and VRMs. In addition, this thermal heat sink can be used in applications where there is limited space, such as custom laptops or desktop computers. As an example, the ATS-11E-25-C2-R0 can be used to cool down a high-end gaming laptop. Due to its small size, this thermal heat sink does not take up too much space in the laptop but still provides sufficient cooling. Additionally, due to its low power rating, the ATS-11E-25-C2-R0 is suitable for small form-factor PCs and other power-sensitive electronics applications.
Working Principle
The ATS-11E-25-C2-R0 thermal heat sink is composed of an aluminum heat sink, a compressed, thermally conductive heat sink interface material, and a molded plastic cap. The heat sink interface material between the aluminum heat sink and the electronics device ensures a thermal connection between the two components. As heat is generated by the device, it is absorbed by the heat sink and dissipated to the outside environment. The plastic cap absorbs sound waves generated by the device, reducing noise pollution.
The ATS-11E-25-C2-R0 is designed to handle temperatures up to 150°C (302°F). To ensure safety and long-term performance, the highest temperature is limited by the type of aluminum used in the heat sink. In addition, the fins on the aluminum heat sink are designed to spread radiated heat away from the electronics and to increase the overall surface area exposure to ambient air. This helps minimize any hot spots and ensures an even temperature distribution.
The ATS-11E-25-C2-R0 also has integrated fan speed control. This feature allows the fan speeds to be adjusted manually or automatically, depending on the user’s requirements. The integrated fan speed control also ensures that the fan is running at peak efficiency, while minimizing power consumption and wear-and-tear.
Conclusion
The ATS-11E-25-C2-R0 thermal heat sink is an ideal solution for cooling a variety of electronics devices and components. Its small size and low power consumption make it suitable for a wide range of applications. The integrated fan speed control ensures efficient and reliable cooling, while the aluminum heat sink and thermally conductive interface material absorb and dissipate heat away from the device. The ATS-11E-25-C2-R0 is an excellent choice for anyone looking for an economical, reliable, and efficient thermal heat sink.
The specific data is subject to PDF, and the above content is for reference