ATS-11E-37-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11E-37-C1-R0-ND

Manufacturer Part#:

ATS-11E-37-C1-R0

Price: $ 5.43
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11E-37-C1-R0 datasheetATS-11E-37-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.88124
30 +: $ 4.60992
50 +: $ 4.33881
100 +: $ 4.06766
250 +: $ 3.79648
500 +: $ 3.52531
1000 +: $ 3.45751
Stock 1000Can Ship Immediately
$ 5.43
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-11E-37-C1-R0 is an electromagnetic thermal and heat sink that is designed to handle applications across a wide variety of thermal applications. This type of equipment is used for increasing thermal stability when it comes to devices which require a great deal of heat and cooling. The ATS-11E-37-C1-R0 is a popular choice for thermal management because of its superior performance over other traditional thermal sinks.In general, the process of thermal management involves the use of cooling systems to lower temperature levels and the use of heating elements to raise temperature levels. Heat sinks are a critical component of these processes as they are designed to absorb and dissipate heat away from the device that requires cooling. Heat sinks are pieces of hardware that are designed to act as a heat transfer medium between a device and its environment. Heat sink technology works by absorbing the heat of a device and dissipating it away from the device and into the environment.The ATS-11E-37-C1-R0 is a heat sink designed to provide excellent performance in the most demanding thermal environments. This equipment has a high performance, low profile design and is constructed from die-cast aluminum alloy. This material is chosen for its resistance to heat and its low weight, ensuring that it can handle large amounts of heat without becoming too heavy for the device.The working principle of the ATS-11E-37-C1-R0 is based on the physical laws of thermoelectricity. Thermoelectricity is the transfer of thermal energy into electrical energy. In the ATS-11E-37-C1-R0, this process occurs by using electrical components to convert heat into electricity. By using the device’s electrical components, the device’s excess heat can be converted into electricity, which can then be used to power other devices or to provide additional cooling to the device.In terms of usage, the ATS-11E-37-C1-R0 is designed for use in a wide range of applications. It is a highly efficient and cost-effective solution for cooling small domestically used appliances or equipment such as laptops and microprocessors. The device is also able to handle larger appliances such as air conditioners and refrigerators with the same level of performance.In terms of design, the ATS-11E-37-C1-R0 has a sleek design that allows it to fit perfectly in a variety of spaces. It is designed with a low profile to accommodate space constraints, ensuring that it can fit into tight spaces. Moreover, the device has various mounting options available for easy installation and long-term maintenance.In conclusion, the ATS-11E-37-C1-R0 is an advanced, reliable and cost-effective thermal management solution. It is a high performance device that is designed to provide superior cooling capability in any application. Its superior design and construction make it an ideal choice for any thermal application, allowing users to benefit from its superior performance and cost-effectiveness.

The specific data is subject to PDF, and the above content is for reference

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