ATS-11E-60-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11E-60-C3-R0-ND

Manufacturer Part#:

ATS-11E-60-C3-R0

Price: $ 4.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11E-60-C3-R0 datasheetATS-11E-60-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.95577
30 +: $ 3.73611
50 +: $ 3.51628
100 +: $ 3.29654
250 +: $ 3.07677
500 +: $ 2.85700
1000 +: $ 2.80206
Stock 1000Can Ship Immediately
$ 4.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are used in a variety of applications ranging from consumer electronics to industrial and commercial applications. ATS-11E-60-C3-R0 is a type of thermal-heat sink which is used in cooling or dissipating heat generated by high power electronic devices such as computers and servers. By using thermal-heat sinks, the devices that generate heat can be kept in a safe and cool operating environment.

The ATS-11E-60-C3-R0 thermal-heat sink is a shallow fin heat sink designed to provide excellent thermal performance. The thermal-heat sink uses a combination of extruded copper fin and aluminum base which is excellent for heat dissipation and also helps in maintaining a low temperature for the electronic device. The fin design also helps air to flow through the fins, which helps in the convection cooling process. The extruded fins also feature a thermal adhesive which helps in better heat transfer and facilitates better heat removal. The thermal-heat sink also features an integrated heat spreader which helps in evenly distributing the generated heat across the fin surface, ensuring better cooling performance.

The ATS-11E-60-C3-R0 thermal-heat sink works on the principle of convection cooling. The heat from the component will be transferred to the fins via direct conduction or indirect conduction. The heat then dissipates to the environment through natural convection and radiation. As the air flows through the fins of the thermal-heat sink, it absorbs the heat and transfers it from the fins to the environment. The airflow also helps in dissipating the heat away from the component, thereby keeping it cool.

The ATS-11E-60-C3-R0 thermal-heat sink is used in a variety of applications such as high-performance computing, medical electronics, LED lighting, automotive electronics, industrial automation and robotics, servers and network systems, and consumer electronics. The thermal-heat sink ensures reliable cooling performance in these applications, making it ideal for use in a variety of environments.

The ATS-11E-60-C3-R0 thermal-heat sink is a highly efficient cooling solution and offers excellent thermal performance. It offers a cost-effective way to cool high power electronics as it is relatively inexpensive compared to other cooling solutions. It helps in keeping the electronic device at a safe operating temperature, and ensures a reliable and long-term cooling performance.

In summary, the ATS-11E-60-C3-R0 thermal-heat sink is an effective and efficient cooling solution for a variety of applications. Its design ensures reliable heat transfer and helps to keep the electronic device at a safe and cool operating environment. Its lightweight design and low cost make it a popular choice for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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