| Allicdata Part #: | ATS-11E-75-C1-R0-ND |
| Manufacturer Part#: |
ATS-11E-75-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-75-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat is a major cause of damage to electronic equipment, and controlling the effects of heat is one of the most important aspects of designing a reliable system. The ATS-11E-75-C1-R0 is a thermal heat sink designed to ensure acceptable temperatures for a wide range of electric systems.
The ATS-11E-75-C1-R0 is a passive thermal solution, meaning it does not require an external power source to operate. It is designed to deliver excellent thermal performance to dissipate and spread heat from critical hotspots within an electronic system. The solution utilizes off-the-shelf components and a micro-channel design, which ensures a low profile and high performance, and makes installation easy.
The ATS-11E-75-C1-R0 is a solid, compact heat sink that acts as a bridge between the electronics and the environment. It is made out of aluminum, which is highly conductive, robust and lightweight. The thermal solution is designed to provide excellent performance and can be used in a variety of applications, such as handheld electronics, rack-mounted servers and medical devices.
The ATS-11E-75-C1-R0 works by dissipating the heat away from the source through conduction and convection. The conduction process transfers heat from the source into the heat sink, which is then dissipated by the heat sink\'s surfaces. The convection process directs the air around the heat sink, pushing hot air away and drawing in cooler air, which helps optimise the cooling process further.
The ATS-11E-75-C1-R0 is an easy to install, cost-efficient and reliable thermal solution for a range of electronic systems. It is suitable for use in small spaces, as it takes up a minimal amount of space and is lightweight. Additionally, the micro-channel design offers excellent thermal performance with low pressure drops, making it ideal for applications that require high performance.
The ATS-11E-75-C1-R0 is a superior thermal heat sink solution for a wide range of applications, from handheld electronics to rack-mounted servers. Its high performance and easy installation features make it an ideal solution for customers looking for a reliable and cost-effective thermal solution.
The specific data is subject to PDF, and the above content is for reference